Ion implant system having grid assembly

• US 9,303,314 B2
• Filed: 10/08/2014
• Issued: 04/05/2016
• Est. Priority Date: 06/23/2009
• Status: Active Grant

• Current Assignee: Intevac
• Original Assignee: Intevac
• Inventors: Adibi, Babak, Chun, Moon
• Primary Examiner(s): Smoot, Stephen W
• Assistant Examiner(s): Chin, Edward
• Application Number:
  US14/510,109
• Publication Number:
  US 20150072461A1
• Time in Patent Office: 545 Days
• Field of Search: 118/723.R, 204/192.12, 204/192.15, 204/192.17, 204/298.06, 204/298.11, 204/298.16, 204/298.26, 427/569
• US Class Current: 1/1
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/48 Ion implantation
• CPC Class Codes: H01J 2237/0437 Semiconductor substrate
• CPC Class Codes: H01J 2237/184 Vacuum locks
• CPC Class Codes: H01J 2237/201 for mounting multiple objects
• CPC Class Codes: H01J 2237/327 Arrangements for generating the plasma
• CPC Class Codes: H01J 2237/3365 Plasma source implantation
• CPC Class Codes: H01J 37/185 Means for transferring objects between different enclosures of different pressure or atmosphere
• CPC Class Codes: H01J 37/3171 for ion implantation plasma immersion ion implantation H01J37/32412
• CPC Class Codes: H01J 37/32412 Plasma immersion ion implantation
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01L 21/2236 from or into a plasma phase
• CPC Class Codes: H01L 31/068 the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
• CPC Class Codes: H01L 31/0682 back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
• CPC Class Codes: H01L 31/1804 comprising only elements of Group IV of the Periodic Table
• CPC Class Codes: H01L 31/1864 Annealing
• CPC Class Codes: H01L 31/1876 Particular processes or apparatus for batch treatment of the devices
• CPC Class Codes: Y02E 10/547 Monocrystalline silicon PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

Claims

1. A solar cell implantation system, comprising:

an implant chamber, comprising;

a plasma region;

a plasma source configured to provide plasma in the plasma region;

an implant region for implanting solar cells with ions from the plasma region;

vacuum pump assembly configured to differentially pump the plasma region and the implant region;

a grid plate assembly comprising a plurality of apertures configured to allow ions from the plasma region to pass therethrough to the implant region, and configured to ensure the vacuum pump assembly effectively differentially pumps the plasma region and implant region;

a multi-stage differentially pumped system comprising;

a plurality of increased vacuum stages, each with increasing level of vacuum leading to the implant region, wherein the implant region having highest level of vacuum;

a plurality of reduced vacuum stages, each with a decreasing level of vacuum leading away from the implant region;

a conveyor system for transporting solar cells from atmospheric side and through the multi-stage differentially pumped system, and for positioning the solar cells underneath the grid assembly to be implanted at the implant stage.

2. The system of claim 1, wherein the grid assembly is configured to pass beamlets of ions from the plasma region to the implant region, and wherein the conveyor system is configured to place the solar cells underneath the grid assembly at a distance far enough where the beamlets have converged to a uniform beam.

3. The system of claim 1, further comprising a masking arrangement configured to generate selectively implanted regions on the solar cells.

4. The system of claim 1, wherein the selectively implanted regions comprise a series of interdigitated alternate doping regions of n-type and p-type.

5. The system of claim 4, wherein the masking arrangement comprises a shadow mask on the solar cell.

6. The system of claim 1, wherein the implant region is configured for implanting multiple solar cells simultaneously.

7. The system of claim 1, wherein the system is configured for homogeneous implantation followed by masked selective implantation.

8. The system of claim 7, wherein the apertures of at least one of the grid assembly and the mask are elongated slots.

9. The system of claim 1, further comprising cooling arrangement to cool the solar cells.

10. The system of claim 1, wherein the first grid plate and the second grid plate comprise a material chosen from the group consisting of:

silicon, graphite, silicon carbide, and tungsten.

11. The system of claim 1, further comprising a hydrogen supply wherein the implant chamber is configured for hydrogen implant simultaneously with other dopant.

12. The system of claim 11, wherein hydrogen gas supply comprises supply of one of PH₃ Or B₂H₆.

13. The system of claim 12, wherein the first grid plate is configured to be positively-biased, either continuously in DC mode or in pulsed mode.

14. The system of claim 1, wherein the plasma chamber is configured for auto-annealing by forming an ion beam and heating the solar cells with the ion beam.

15. The system of claim 1, wherein the grid assembly comprises:

a positively biased first grid plate comprising a plurality of apertures configured to allow ions from the plasma region to pass therethrough;

a negatively biased second grid plate comprising a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate;

a grounded third grid plate comprising a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the second grid plate; and

,

wherein the first grid plate is configured to accelerate ions from the plasma, the second grid plate is configured to suppress electrons that come off the substrate, and the third grid plate is configured to function as beam defining grid.

16. The system of claim 15, wherein the third grid plate is removable.

17. A method for forming solar cells in an implant chamber having a plasma region and implant region defined by a grid assembly, comprising:

differentially pumping the plasma region and the implant region of an implant chamber;

supplying doping gas into the plasma region;

sustaining plasma in the plasma region;

loading wafers onto a conveyor system and operating the conveyor to deliver the wafer to the implant region through a plurality of increased vacuum stages, each with increasing level of vacuum leading to the implant region, wherein the implant region having highest level of vacuum, and to remove the wafers from the implant region through a plurality of reduced vacuum stages, each with a decreasing level of vacuum leading away from the implant region;

positioning the wafers underneath the grid assembly at a distance where beamlets exiting the grid assembly have converged to a uniform beam; and

,

masking the wafers to generate selectively implanted regions on the wafers.

18. The method of claim 17, further comprising adjusting conditions of the plasma to control percentage of each ion species relative to the total ion beam.

19. The method of claim 17, further comprising forming multiple atomic profiles by implanting multiple ion species at different energies.

20. The method of claim 17, comprising implanting multiple wafers simultaneously.

21. The method of claim 17, comprising forming a homogeneous implantation on the wafers, followed by masked selective implantation on the wafers.

22. The method of claim 17, comprising simultaneously implanting hydrogen and dopant ions.

23. The method of claim 17, further comprising heating the wafers with the ion beam to cause self-annealing of the wafer.