Conductive structure, touch panel, and method for manufacturing same

• US 9,307,633 B2
• Filed: 03/28/2012
• Issued: 04/05/2016
• Est. Priority Date: 03/28/2011
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Hwang, Ji Young, Park, Min Choon, Son, Yong Goo, Koo, Beom Mo
• Primary Examiner(s): Norris, Jeremy C
• Application Number:
  US14/008,245
• Publication Number:
  US 20140016278A1
• Time in Patent Office: 1,469 Days
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 3/002 by liquid chemical etching
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Provided are a conductive structure including a) a base, b) a conductive pattern provided on at least one side of the base, and c) a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area, and a touch panel including the same and a manufacturing method thereof.

Claims

1. A conductive structure, comprising:

a) a base;

b) a conductive pattern provided on at least one side of the base; and

c) a darkening layer provided on the upper surface and the lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern,

wherein the conductive pattern consists of gold, silver, aluminum, copper, neodymium, molybdenum, nickel or an alloy thereof.

2. The conductive structure of claim 1, wherein a color range of a pattern area configured by the darkening layer and the conductive pattern, which is measured at the surface where the darkening layer of the conductive substrate is viewed, has a L value of 20 or less, an A value of −

10 to 10, and a B value of −

70 to 70 based on the CIE LAB color coordination.

3. The conductive structure of claim 1, wherein total reflectivity in the pattern area configured by the darkening layer and the conductive pattern, which is measured at the surface where the darkening layer of the conductive substrate is viewed, is 17% or less based on 550 nm.

4. The conductive structure of claim 1, wherein the darkening layer includes one kind or more selected from a group constituted by a dielectric material, a metal, a metal alloy, a metal oxide, a metal nitride, a metal oxynitride, and a metal carbide.

5. The conductive structure of claim 4, wherein the metal includes one kind or more selected from a group constituted by Ni, Mo, Ti, Cr, Al, Cu, Fe, Co, Ti, V, Au and Ag.

6. The conductive structure of claim 1, wherein total reflectivity in the surface where the darkening layer of the conductive substrate is viewed, is reduced by 15 to 50% as compared with the total reflectivity of the conductive structure having the same configuration except that the darkening layer is not included.

7. The conductive structure of claim 1, wherein a haze value of the conductive structure is 5% or less.

8. The conductive structure of claim 1, further comprising:

a conductive structure including a base, a conductive pattern provided on at least one side of the base, and a darkening layer provided on the upper surface and lower surface of the conductive pattern, provided on at least a part of the side of the conductive pattern, and provided in an area corresponding to the conductive pattern area.

9. The conductive structure of claim 8, wherein an insulating layer is provided between the two conductive structures.

10. The conductive structure of claim 8, wherein the two conductive structures are disposed in opposite directions or in the same direction.

11. The conductive structure of claim 1, wherein the conductive pattern and the darkening layer are provided on both sided of the base, respectively.

12. The conductive structure of claim 1, wherein the conductive pattern is a regular pattern or an irregular pattern.

13. The conductive structure of claim 1, wherein the conductive pattern is the regular pattern and includes cross points formed by crossing any plurality of lines among lines configuring the conductive pattern, and the number of cross points is 3,000 to 122,500in an area of 3.5 cm×

3.5 cm.

14. The conductive structure of claim 13, wherein the number of cross points is 13,611 to 30,625 in an area of 3.5 cm×

3.5 cm.

15. The conductive structure of claim 1, wherein the conductive pattern is the irregular pattern and includes cross points formed by crossing any plurality of lines among lines configuring the conductive pattern, and the number of cross points is 6,000 to 245,500 in an area of 3.5 cm×

3.5 cm.

16. The conductive structure of claim 15, wherein the number of cross points is 13,611 to 30,625 in an area of 3.5 cm×

3.5 cm.

17. The conductive structure of claim 1, wherein the darkening layer has a pattern form having the same line width as or larger line width than the conductive pattern.

18. The conductive structure of claim 1, wherein the line width of the conductive pattern is 10 μ

m or less, the thickness is 10 μ

m or less, and the pitch is 600 μ

m or less.

19. The conductive structure of claim 1, wherein the line width of the conductive pattern is 7 μ

m or less, the thickness is 1 μ

m or less, and the pitch is 400 μ

m or less.

20. The conductive structure of claim 1, wherein the line width of the conductive pattern is 5 μ

m or less, the thickness is 0.5 μ

m or less, and the pitch is 300 μ

m or less.

21. The conductive structure of claim 1, wherein illuminance of the darkening layer is 1 nm or more.

22. The conductive structure of claim 1, wherein illuminance of the darkening layer is 2 nm or more.

23. The conductive structure of claim 1, wherein illuminance of the darkening layer is 5 nm or more.

24. The conductive structure of claim 1, wherein illuminance of the darkening layer is 10 nm or more.

25. The conductive structure of claim 1, wherein all the darkening layers provided on at least a part of the upper surface, the lower surface, and the side surface of the conductive pattern are the same material and subsequently connected to each other.

26. A touch panel including the conductive structure of claim 1.

27. A display including the touch panel of claim 26 and a display module.

28. A manufacturing method of a touch panel, comprising:

forming a conductive pattern on a base;

forming a darkening layer before and after forming the conductive pattern; and

inducing Galvanic corrosion of the darkening layer.

29. A manufacturing method of a touch panel, comprising:

forming a conductive layer for forming a conductive pattern on a base;

depositing a darkening layer before and after forming the conductive layer;

patterning the conductive layer and the darkening layer, respectively or at the same time; and

inducing Galvanic corrosion of the patterned darkening layer.

30. The manufacturing method of a touch panel of claim 29, the Galvanic corrosion is performed during etching and stripping processes of the darkening layer.