Wafer-scale package including power source

• US 9,318,400 B2
• Filed: 02/21/2014
• Issued: 04/19/2016
• Est. Priority Date: 10/26/2010
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: O'Brien, Richard J., Day, John K., Gerrish, Paul F., Mattes, Michael F., Ruben, David A., Grief, Malcolm K.
• Primary Examiner(s): Geyer, Scott B
• Application Number:
  US14/186,039
• Publication Number:
  US 20140171822A1
• Time in Patent Office: 788 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/03 Detecting, measuring or recording fluid pressure within the body other than blood pressure, e.g. cerebral pressure; Measuring pressure in body tissues or organs A61B5/205 takes precedence
• CPC Class Codes: A61B 5/11 Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb for measuring pulse A61B5/02 ;A61B5/1038 takes precedence; motion detection to correct for motion artifacts in physiological signals A61B5/721
• CPC Class Codes: A61N 1/37211 Means for communicating with stimulators
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Claims

1. A device comprising:

a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;

a second substrate that includes at least one of a second semiconductor material and a second insulating material, the second substrate bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates; and

a battery housed in the enclosed cavity, the battery including conductive contacts disposed on a bottom surface of the battery, the conductive contacts soldered to two or more of the plurality of bonding pads such that the bottom surface of the battery faces the surface of the first substrate that includes the bonding pads.

3. The device of claim 1, wherein the first and second substrates include glass substrates.

4. The device of claim 3, wherein the bond between the first and second substrates includes silicon.

5. The device of claim 3, wherein the bond between the first and second substrates includes a light absorbing material, and wherein the light absorbing material absorbs light at a wavelength that is transmitted by one of the first and second substrates.

6. The device of claim 1, wherein one of the first and second substrates includes a silicon substrate, and wherein the other of the first and second substrates includes a glass substrate.

7. The device of claim 1, wherein the battery includes a solid state battery.

8. The device of claim 1, further comprising an integrated circuit in the enclosed cavity, wherein at least a portion of the control module is included on the integrated circuit, and wherein the battery is mounted on the first substrate such that the battery straddles at least a portion of the integrated circuit.

2. The device of clam 1, further comprising a control module disposed within the enclosed cavity, wherein the control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient, and wherein the battery provides power to the control module.

9. A device comprising:

a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;

a second substrate that includes at least one of a second semiconductor material and a second insulating material, the second substrate bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates; and

a battery housed in the enclosed cavity, the battery including conductive contacts on a bottom surface of the battery, wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the bottom surface of the battery faces the surface of the first substrate that includes the bonding pads.

10. The device of claim 9, further comprising an integrated circuit fabricated on one of the first and second substrates, wherein the battery is configured to provide power to the integrated circuit.

11. The device of claim 10, further comprising a sensor, wherein the sensor is connected to the integrated circuit, and wherein the sensor includes one of a temperature sensor, a pressure sensor, an accelerometer, and a gyroscopic sensor.

12. A device comprising:

a first substrate that includes at least one of a first semiconductor material and a first insulating material, the first substrate including a plurality of bonding pads;

a second substrate that includes at least one of a second semiconductor material and a second insulating material, wherein the second substrate defines a recessed region; and

a battery that is fabricated in the recessed region defined by the second substrate, the battery including conductive contacts fabricated on a surface of the battery, wherein the second substrate is bonded to the first substrate such that the first and second substrates enclose the battery, and wherein the conductive contacts are connected to two or more of the plurality of bonding pads such that the surface of the battery including the conductive contacts faces the surface of the first substrate that includes the bonding pads.