Method and system for dynamic control of output power of a leaky wave antenna

• US 9,329,261 B2
• Filed: 03/31/2010
• Issued: 05/03/2016
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): Purvis, Sue A
• Assistant Examiner(s): PATEL, AMAL A
• Application Number:
  US12/751,777
• Publication Number:
  US 20100309069A1
• Time in Patent Office: 2,225 Days
• Field of Search: 343/772, 343/745
• US Class Current: 1/1
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for dynamic control of output power of a leaky wave antenna (LWA) are disclosed and may include configuring one or more LWAs in a wireless device to transmit RF signals at a desired frequency. The LWAs may be integrated in support structures, including an integrated circuit, an integrated circuit package, and/or a printed circuit board. Impedances that are coupled to the LWAs and to a power amplifier enabled to amplify the RF signals may be dynamically configured. A resonant frequency of the LWAs may be tuned, which may be configured to transmit the RF signals at a desired angle from a surface of the support structure. The LWAs may include microstrip or coplanar waveguides where a cavity height of the LWAs may be configured by controlling spacing between conductive lines in the waveguides. The impedances may include capacitor arrays and/or inductors in the support structures.

Claims

1. A method for communication by a wireless device including at least one leaky wave antenna integrated in a support structure and including a resonant cavity formed by a first planar reflective surface and a second planar reflective surface having a reflectivity lower than the first planar reflective surface, the method comprising:

causing the at least one leaky wave antenna to transmit an RF signal at a desired frequency by selecting one feed point from a plurality of feed points of the at least one leaky wave antenna, each of the plurality of feed points being disposed within the resonant cavity at a different distance from the first planar reflective surface to set a different impedance, the selected one feed point determining an impedance of the at least one leaky wave antenna; and

dynamically adjusting one or more impedances coupled to the leaky wave antenna and to a power amplifier that amplifies said RF signal, by selecting individually addressable capacitor arrays and switches that bypass inductors to match the impedance of the at least one leaky wave antenna.

2. The method according to claim 1, wherein the support structure is at least one of an integrated circuit, an integrated circuit package, and a printed circuit board.

3. The method according to claim 1, further comprising:

causing the at least one leaky wave antenna to transmit said RF signal at a desired angle from a surface of said support structure.

4. The method according to claim 1, comprising:

communicating said RF signal between regions within said support structure.

5. The method according to claim 1, wherein the at least one leaky wave antenna includes microstrip waveguides.

6. The method according to claim 5, wherein a cavity height of said at least one leaky wave antenna is based on a spacing between conductive lines in said microstrip waveguides.

7. The method according to claim 1, wherein the at least one leaky wave antenna includes coplanar waveguides.

8. The method according to claim 7, wherein a cavity height of the at least one leaky wave antenna is based on a spacing between conductive lines in said coplanar waveguides.

9. The method according to claim 1, wherein said one or more impedances coupled to the at least one leaky wave antenna are placed in the support structure.

10. The method according to claim 1, wherein said one or more impedances coupled to the at least one leaky wave antenna include switchable inductors placed in the support structure.

11. The method according to claim 1, further comprising dynamically tuning a resonant frequency of the at least one leaky wave antenna.

12. A system for enabling communication, the system comprising:

circuitry including at least one leaky wave antenna integrated in a support structure and including a resonant cavity formed by a first planar reflective surface and a second planar reflective surface having a reflectivity lower than the first planar reflective surface, the circuitry configured to;

cause the at least one leaky wave antenna to transmit an RF signal at a desired frequency by selecting one feed point from a plurality of feed points of the at least one leaky wave antenna, each of the plurality of feed points being disposed within the resonant cavity at a different distance from the first planar reflective surface to set a different impedance, the selected one feed point determining an impedance of the at least one leaky wave antenna;

dynamically adjust one or more impedances coupled to the at least one leaky wave antenna and to a power amplifier that amplifies said RF signal, by selecting individually addressable capacitor arrays and switches that bypass inductors to match the impedance of the at least one leaky wave antenna.

13. The system according to claim 12, wherein the support structure is at least one of an integrated circuit, an integrated circuit package, and a printed circuit board.

14. The system according to claim 12, wherein the circuitry is further configured to cause the at least one leaky wave antenna to transmit said RF signal at a desired angle from a surface of said support structure.

15. The system according to claim 12, wherein the circuitry is operable to communicate said RF signal between regions within said support structure.

16. The system according to claim 12, wherein the at least one leaky wave includes microstrip waveguides.

17. The system according to claim 16, wherein a cavity height of said at least one leaky wave antenna is based on a spacing between conductive lines in said microstrip waveguides.

18. The system according to claim 12, wherein said at least one leaky wave antenna includes coplanar waveguides.

19. The system according to claim 18, wherein a cavity height of said at least one leaky wave antenna is based on a spacing between conductive lines in said coplanar waveguides.

20. The system according to claim 12, wherein said one or more impedances coupled to the at least one leaky wave antenna are placed in the support structure.