Heat dissipating device and blade server

• US 9,351,426 B2
• Filed: 11/12/2013
• Issued: 05/24/2016
• Est. Priority Date: 01/20/2012
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Tian, Weiqiang, Liao, Jianxing, Shui, Ruifeng, Hao, Mingliang
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): Patel, Mukund G
• Application Number:
  US14/077,455
• Publication Number:
  US 20140071618A1
• Time in Patent Office: 924 Days
• Field of Search: 361/679.54
• US Class Current: 1/1
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20754 Air circulating in closed loop within cabinets

Abstract

Embodiments of the present invention relate to a heat dissipating device including a chassis, a backplane, at least one rear board, and at least one fan, where the chassis includes horizontal wall panels, vertical wall panels, and a rear wall panel; the chassis includes one or more partition plates; the rear board includes one or more second hole areas; and the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the rear board form a cooling air duct that does not pass a front board, so that under an effect of the fan, a cooling air flow is discharged out of the chassis after passing the rear board, the second hole area, and the fan, so as to implement heat dissipation for a functional module on the rear board.

Claims

1. A heat dissipating device used for a blade server, comprising:

a chassis;

a backplane;

two or more rear boards; and

at least one fan,

wherein the chassis comprises horizontal wall panels, vertical wall panels, and a rear wall panel,

wherein the backplane is disposed in the chassis and is configured to connect to a front board inserted from a front of the chassis and the two or more rear boards inserted from a back of the chassis,

wherein the at least one fan is disposed in a rear part of the chassis and is configured to dissipate heat out of the chassis,

wherein the backplane has one or more first hole areas such that under an effect of the at least one fan, heat generated by the front board is discharged out of the chassis through the one or more first hole areas after passing the backplane and the at least one fan,

wherein the chassis comprises one or more partition plates,

wherein the two or more rear boards comprise a first rear board and a second rear board,

wherein the first rear board comprises two or more second hole areas, and the second rear board comprises one or more second hole areas,

wherein the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the two or more rear boards form a cooling air duct that does not pass the front board such that under the effect of the at least one fan, a cooling air flow is discharged out of the chassis after passing the two or more rear boards and the at least one fan to implement heat dissipation for a functional module on the two or more rear boards,

wherein the first rear board and the second rear board are disposed side by side on one side of the at least one fan,

wherein the first rear board is a rear board at which the cooling air flow first arrives,

wherein the second rear board is a rear board at which the cooling air flow next arrives,

wherein the two or more second hole areas for the first rear board are provided respectively at a front end of the first rear board that is close to the backplane and a rear end of the first rear board that is close to the rear wall panel, and

wherein the one or more second hole areas for the second rear board are provided at a front end of the second rear board that is close to the backplane.

2. The device according to claim 1, wherein under the effect of the at least one fan, the cooling air flow first passes a side on which a functional module requiring heat dissipation is disposed on the first rear board, then passes the second rear board, and the at least one fan, and is discharged out of the chassis, or wherein under the effect of the at least one fan, the cooling air flow first passes a side on which no functional module requiring heat dissipation is disposed on the first rear board, then passes a side on which the functional module requiring heat dissipation is disposed on the second rear board, the at least one fan, and is discharged out of the chassis.

3. The device according to claim 2, wherein after the cooling air flow arrives at the second hole area at the rear end of the first rear board under the effect of the at least one fan, one part of the cooling air flow passes a side on which a functional module requiring heat dissipation is disposed on the first rear board to dissipate heat of the functional module, and is discharged out of the chassis by the at least one fan after passing the second hole area on the second rear board, and wherein another part of the cooling air flow arrives at a side on which a functional module requiring heat dissipation is disposed on the second rear board to dissipate heat of the functional module, and is discharged out of the chassis by the at least one fan after passing the second hole area on the second rear board.

4. The device according to claim 2, wherein the rear wall panel, the vertical wall panels, and the horizontal wall panels in the chassis form a protrusive trough cover, wherein the trough cover covers a rear part of the chassis in a sealing manner, wherein the rear part of the chassis is a part which is close to the at least one fan and is away from the backplane, and wherein after the cooling air flow arrives at the trough cover under the effect of the at least one fan, the cooling air flow passes respectively a side on which a functional module requiring heat dissipation is disposed on the first rear board and a side on which a functional module requiring heat dissipation is disposed on the second rear board, flows out respectively from the second hole area at the front end of the first rear board and the second hole area at the front end of the second rear board, and is discharged out of the chassis by the at least one fan.

5. The device according to claim 1, the cooling air flow first passes an optical module to dissipate heat of the optical module, and then dissipates heat of another functional module requiring heat dissipation.

6. The device according to claim 1, wherein the cooling air duct is located on a left side or a right side of the chassis, or wherein the cooling air duct is located on both the left side and the right side of the chassis.

7. A blade server, comprising:

a chassis;

a backplane;

at least one front board;

two or more rear boards; and

at least one fan,

wherein the chassis comprises horizontal wall panels, vertical wall panels, and a rear wall panel,

wherein the backplane is disposed in the chassis and is configured to connect to the at least one front board inserted from a front of the chassis and the two or more rear boards inserted from a back of the chassis,

wherein the at least one fan is disposed in a rear part of the chassis and is configured to dissipate heat out of the chassis,

wherein the backplane has one or more first hole areas such that under an effect of the at least one fan, heat generated by the at least one front board is discharged out of the chassis through the one or more first hole areas after passing the backplane and the at least one fan,

wherein the chassis comprises one or more partition plates,

wherein the two or more rear boards comprise a first rear board and a second rear board,

wherein the first rear board comprises two or more second hole areas, and the second rear board comprises one or more second hole areas,

wherein the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the two or more rear boards form a cooling air duct that does not pass the at least one front board such that under the effect of the at least one fan, a cooling air flow is discharged out of the chassis after passing the two or more rear boards and the at least one fan to implement heat dissipation for a functional module on the two or more rear boards,

wherein the first rear board and the second rear board are disposed side by side on one side of the at least one fan,

wherein the first rear board is a rear board at which the cooling air flow first arrives,

wherein the second rear board is a rear board at which the cooling air flow next arrives,

wherein the two or more second hole areas for the first rear board are provided respectively at a front end of the first rear board that is close to the backplane and a rear end of the first rear hoard that is close to the rear wall panel, and

wherein the one or more second hole areas for the second rear board are provided at a front end of the second rear board that is close to the backplane.

8. The server according to claim 7, wherein under the effect of the at least one fan, the cooling air flow first passes a side on which a functional module requiring heat dissipation is disposed on the first rear board, then passes the second rear board, and the at least one fan, and is discharged out of the chassis, or wherein under the effect of the at least one fan, the cooling air flow first passes a side on which no functional module requiring heat dissipation is disposed on the first rear board, then passes a side on which the functional module requiring heat dissipation is disposed on the second rear board, the at least one fan, and is discharged out of the chassis.

9. The server according to claim 8, wherein after the cooling air flow arrives at the second hole area at the rear end of the first rear board under the effect of the at least one fan, one part of the cooling air flow passes a side on which a functional module requiring heat dissipation is disposed on the first rear board to dissipate heat of the functional module, and is discharged out of the chassis by the at least one fan after passing the second hole area on the second rear board, and wherein another part of the cooling air flow arrives at a side on which a functional module requiring heat dissipation is disposed on the second rear board to dissipate heat of the functional module, and is discharged out of the chassis by the at least one fan after passing the second hole area on the second rear board.

10. The server according to claim 7, wherein the cooling air flow first passes an optical module to dissipate heat of the optical module, and then dissipates heat of another functional module requiring heat dissipation.

11. A heat dissipating device used for a blade server, comprising:

a chassis;

a backplane;

at least one rear board; and

at least one fan,

wherein the chassis comprises horizontal wall panels, vertical wall panels, and a rear wall panel,

wherein the backplane is disposed in the chassis and is configured to connect to a front board inserted from a front of the chassis and the at least one rear board inserted from a back of the chassis,

wherein the at least one fan is disposed in a rear part of the chassis and is configured to dissipate heat out of the chassis,

wherein the backplane has one or more first hole areas such that under an effect of the at least one fan, heat generated by the front board is discharged out of the chassis through the one or more first hole areas after passing the backplane and the at least one fan,

wherein the chassis comprises one or more partition plates,

wherein the at least one rear board comprises one or more second hole areas,

wherein the one or more partition plates, the horizontal wall panels, the vertical wall panels, the rear wall panel, the backplane, and the at least one rear board form a cooling air duct that does not pass the front board such that under the effect of the at least one fan, a cooling air flow is discharged out of the chassis after passing the at least one rear board, the one or more second hole areas, and the at least one fan to implement heat dissipation for a functional module on the at least one rear board,

wherein the rear wall panel, the vertical wall panels, and the horizontal wall panels in the chassis form a protrusive trough cover,

wherein the trough cover covers a rear part of the chassis in a sealing manner,

wherein the rear part of the chassis is a part which is close to the at least one fan and is away from the backplane,

wherein the device comprises two or more rear boards,

wherein the two or more rear boards comprise a first rear board and a second rear board,

wherein the first rear board and the second rear board are disposed side by side on one side of the at least one fan,

wherein the first rear board is a rear board at which the cooling air flow first arrives,

wherein the second rear board is a rear board at which the cooling air flow next arrives,

wherein the second hole area is provided at a front end of the first rear board and is close to the backplane,

wherein the second hole area is provided at a front end of the second rear board and is close to the backplane, and

wherein after the cooling air flow arrives at the trough cover under the effect of the at least one fan, the cooling air flow passes respectively a side on which a functional module requiring heat dissipation is disposed on the first rear board and a side on which a functional module requiring heat dissipation is disposed on the second rear board, flows out respectively from the second hole area at the front end of the first rear board and the second hole area at the front end of the second rear board, and is discharged out of the chassis by the at least one fan.