Laser diode assembly

• US 9,356,423 B2
• Filed: 09/25/2014
• Issued: 05/31/2016
• Est. Priority Date: 03/19/2012
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Strauss, Uwe, Tautz, Soenke, Lell, Alfred, Auen, Karsten, Vierheilig, Clemens
• Primary Examiner(s): NGUYEN, DUNG T
• Application Number:
  US14/496,975
• Publication Number:
  US 20150288138A1
• Time in Patent Office: 614 Days
• Field of Search: 372/33, 372/36, 372/43.01
• US Class Current: 1/1
• CPC Class Codes: H01S 2301/176 Specific passivation layers on surfaces other than the emission facet
• CPC Class Codes: H01S 5/022 Mountings; Housings
• CPC Class Codes: H01S 5/02212 Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
• CPC Class Codes: H01S 5/0282 Passivation layers or treatments
• CPC Class Codes: H01S 5/32341 blue laser based on GaN or GaP

Abstract

A laser diode assembly includes a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 3 μm is arranged between the laser diode chip and the mounting part.

Claims

1. A laser diode assembly comprising:

a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction;

a laser diode chip disposed on the mounting part, the laser diode chip having semiconductor layers on a substrate, wherein the semiconductor layers include an active layer for emitting light, wherein the laser diode chip is based on a nitride compound semiconductor material;

a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μ

m; and

a crystalline protective layer located on a radiation coupling out area of the laser diode chip.

2. The laser diode assembly according to claim 1, wherein the housing part and the mounting part have a main body composed of copper, and wherein the housing part is steel coated.

3. The laser diode assembly according to claim 1, wherein the active layer has an area of greater than or equal to 10,000 μ

m.

4. The laser diode assembly according to claim 1, wherein the thickness of the first solder layer is greater than or equal to 5 μ

m.

5. The laser diode assembly according to claim 1, wherein a heat conducting element is arranged between the laser diode chip and the mounting part.

6. The laser diode assembly according to claim 5, wherein the heat conducting element is fixed on the mounting part by the first solder layer and the laser diode chip is fixed on the heat conducting element by a second solder layer.

7. The laser diode assembly according to claim 6, wherein the second solder layer has a thickness of greater than or equal to 3 μ

m.

8. The laser diode assembly according to claim 5, wherein the heat conducting element comprises SiC, BN, CuW or diamond.

9. The laser diode assembly according to claim 1, further comprising a housing cover applied on the housing part and welded to the housing part, wherein the mounting part projects into the housing cover from the housing part along the extension direction.

10. The laser diode assembly according to claim 9, wherein the mounting part projects as far as the housing cover at least at one side perpendicularly to the extension direction.

11. The laser diode assembly according to claim 9, wherein the housing part and the housing cover have a circular cross section in a plane perpendicular to the extension direction and the mounting part has a cross section occupying more than a semicircular area in a plane perpendicular to the extension direction.

12. The laser diode assembly according to claim 1, wherein the mounting part has a cross section that increases in size in a direction of the housing part.

13. The laser diode assembly according to claim 12, wherein the mounting part has a wedge shaped cross section in a plane parallel to the extension direction.

14. The laser diode assembly according to claim 13, wherein the housing part has a wedge shaped cross section in a plane parallel to the extension direction.

15. A laser diode assembly comprising:

a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction;

a laser diode chip disposed on the mounting part, the laser diode chip having semiconductor layers on a substrate, the semiconductor layers including an active layer for emitting light, wherein the laser diode chip is based on a nitride compound semiconductor material and has a non-polar or semi-polar crystal structure; and

a first solder layer arranged between the laser diode chip and the mounting part, the first solder layer having a thickness of greater than or equal to 3 μ

m, wherein, during operation, the laser diode chip has a higher power loss in layers on that side of the active layer which faces away from the substrate and a lower power loss in the active layer, than a laser diode chip that is based on a nitride compound semiconductor material and has a polar crystal structure.

16. A laser diode assembly comprising:

a housing having a housing part and a mounting part that is connected to the housing part and that extends away from the housing part along an extension direction;

a laser diode chip disposed on the mounting part, the laser diode chip having semiconductor layers on a substrate, wherein the semiconductor layers include an active layer for emitting light, wherein the laser diode chip is based on a nitride compound semiconductor material; and

a first solder layer arranged between the laser diode chip and the mounting part, wherein the housing part and the mounting part have a main body composed of copper, and wherein the housing part is steel coated.