Circuit board having a plated through hole through a conductive pad

  • US 9,357,639 B2
  • Filed: 02/27/2015
  • Issued: 05/31/2016
  • Est. Priority Date: 03/18/2008
  • Status: Active Grant
First Claim
Patent Images

1. An interconnectable circuit board, comprising:

  • a distal end having a first electrically conductive pad located on a top of the circuit board;

    a plated through hole on the conductive pad which passes through a conductive layer of the circuit board and an insulative layer of the circuit board;

    a second electrically conductive pad coupled to the plated through hole; and

    a proximal end having a third electrically conductive pad attached to the top of the circuit board.

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