Integrated electric field sensor

• US 9,360,501 B2
• Filed: 06/01/2011
• Issued: 06/07/2016
• Est. Priority Date: 06/01/2010
• Status: Active Grant

• Current Assignee: Regents of the University of California (University of California)
• Original Assignee: Regents of the University of California (University of California)
• Inventors: Chi, Yu Mike, Cauwenberghs, Gert, Maier, Christoph Hans
• Primary Examiner(s): Nguyen, Tung X
• Assistant Examiner(s): Allgood, Alesa
• Application Number:
  US13/701,468
• Publication Number:
  US 20130300435A1
• Time in Patent Office: 1,833 Days
• US Class Current: 1/1
• CPC Class Codes: G01R 1/30 Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
• CPC Class Codes: G01R 19/0023 Measuring currents or voltages from sources with high internal resistance by means of measuring circuits with high input impedance, e.g. OP-amplifiers electrostatic instruments G01R5/28; measuring electrostatic potential G01R15/165; measuring electrostatic fields G01R29/12; amplifiers per se H03F
• CPC Class Codes: G01R 29/12 Measuring electrostatic fields or voltage-potential

Abstract

An electric field sensor includes one or more sensing electrodes connected to an integrated amplifier that bootstraps all parasitic capacitances at the sensor input to provide for a very high input impedance without the need for neutralization or other adjustments and calibration. The integrated amplifier for the electric field sensor further includes low-noise ESD/biasing structures to stabilize the DC-potential of the sensor with a minimum amount of added noise, leakage and parasitic capacitance.

Claims

1. An electric field sensor, comprising:

at least one sensing electrode for detecting an electric field and generating an input signal;

a sensor input connected to the at least one sensing electrode for receiving the input signal;

an integrated amplifier adapted to generate at least one buffered output signal that replicates the input signal, the integrated amplifier comprising a substrate, a package assembly and a plurality of circuit elements integrated on the substrate and enclosed within the package assembly, each circuit element comprising a plurality of terminals, wherein a first portion of the plurality of terminals is connected to the sensor input;

an active shield in electrical communication with an output of the integrated amplifier so that the at least one buffered output signal drives the active shield; and

wherein the first portion of the plurality of terminals is shielded from the substrate and the package assembly by a second portion of the plurality of terminals substantially following one of the input signal and the buffered output signal.

2. The sensor of claim 1, wherein at least one of the circuit elements connected to the sensor input comprises a bonding connection between a chip bond-pad disposed on the substrate and one or more circuit components external to the substrate, and wherein said bonding connection is guarded with the active shield.

3. The sensor of claim 1, wherein the package assembly comprises a conductive portion in electrical communication with the active shield, thereby bootstrapping and shielding the integrated amplifier from external interference and parasitic capacitance.

4. The sensor of claim 1, wherein at least one of the circuit elements connected to the sensor input comprises an external connection between the sensor electrode and the integrated amplifier, and wherein the external connection is bootstrapped by the active shield.

5. The sensor of claim 1, wherein at least one of the circuit elements comprises a field effect transistor having a gate, a drain, a source and a body terminal, and wherein the gate is connected to the sensor input and the source and the body terminals are connected together.

6. The sensor of claim 5, wherein a current between the source and the drain of the field effect transistor is maintained at a constant level so that a potential between the gate and the source and the body terminal is substantially constant, whereby the source and the body terminal are bootstrapped.

7. The sensor of claim 5, wherein the drain of the field effect transistor is connected to a drain bootstrap amplifier that replicates the signal from the active shield to bootstrap the drain.

8. The sensor of claim 5, wherein at least one of the plurality of circuit elements connected to the sensor input comprises an internal connection connected to the gate of the field effect transistor and wherein the internal connection is bootstrapped by the active shield.

9. The sensor of claim 8, wherein the internal connection links the gate of the field effect transistor to a chip bond-pad disposed on the substrate and wherein the chip bond-pad is guarded with the active shield to reduce a parasitic capacitance of the chip bond-pad.

10. The sensor of claim 5, wherein at least one of the circuit elements connected to the sensor input comprises of a floating gate without conductive connections to the gate of the field effect transistor to sustainably eliminate a leakage current at the sensor input.

11. The sensor of claim 10, wherein the floating gate is programmed via a non-volatile charge writing mechanism.

12. The sensor of claim 1, wherein at least one of the circuit elements connected to the sensor input comprises an electrostatic discharge (ESD) and biasing structure connected to the sensor input.

13. The sensor of claim 12, wherein the ESD and biasing structure comprise at least one diode, wherein the diode is bootstrapped by driving the diode with the active shield to maintain a potential difference of zero between the diode and the sensor input.

14. The sensor of claim 1, wherein the at least one sensor electrode comprises multiple electrodes, and further comprising:

a sensor body having a first surface and a second surface, wherein the multiple electrodes are disposed on the first surface and the sensor input, integrated amplifier and active shield are disposed on the second surface; and

wherein the multiple electrodes comprise a combination of electrodes defining at least two pairs of active electrode signal sources and a reference electrode;

a differential amplifier connected to each pair of active electrode signal sources for generating an output comprising a potential difference across the connected pair of active electrode signal sources; and

wherein the potential difference across each pair of active electrode signal sources is used to determine a local spatial electric field.

15. The sensor of claim 14, further comprising an inverter having an output connected to the reference electrode, wherein the reference electrode is actively driven with a signal obtained by inverting a combination of potentials registered by the electrodes.

16. The sensor of claim 14, wherein an active electrode signal source comprises one active electrode that provides a shared input to each of at least two differential amplifiers, so that two or more pairs of active electrodes include the one active electrode.

17. The sensor of claim 14, wherein the combination of electrodes comprises at least two pairs of active electrodes, wherein each pair of active electrodes is connected to a corresponding differential amplifier.

18. The sensor of claim 17, wherein the at least two pairs of active electrodes are arranged in an orthogonal relationship.

19. An electric field sensor, comprising:

at least one sensing electrode for detecting an electric field and generating an input signal;

a sensor input connected to the at least one sensing electrode for receiving the input signal;

an integrated amplifier adapted to generate at least one buffered output signal that replicates the input signal, the integrated amplifier comprising a substrate, a package assembly and a plurality of circuit elements integrated on the substrate and enclosed within the package assembly, each circuit element comprising a plurality of terminals, wherein a first portion of the plurality of terminals is connected to the sensor input, the integrated amplifier further comprising an input transistor having a gate, a drain, a source and a body terminal, and wherein the gate is connected to the sensor input and the source and the body terminals are connected together;

an active shield in electrical communication with an output of the integrated amplifier so that the at least one buffered output signal drives the active shield;

wherein the first portion of the plurality of terminals is shielded from the substrate and the package assembly by a second portion of the plurality of terminals substantially following one of the input signal and the buffered output signal.

20. The sensor of claim 19, wherein a current between the source and the drain of the input transistor is maintained at a constant level so that a potential between the gate and the source and the body terminal is substantially constant, whereby the source and the body terminal are bootstrapped.

21. The sensor of claim 19, wherein the drain of the field effect transistor is connected to a drain bootstrap amplifier that replicates the signal from the active shield to bootstrap the drain.

22. The sensor of claim 19, wherein at least one of the plurality of circuit elements connected to the sensor input comprises an internal connection connected to the gate of the input transistor and wherein the internal connection is bootstrapped by the active shield.

23. The sensor of claim 19, wherein the internal connection links the gate of the input transistor to a chip bond-pad on the semiconductor substrate and wherein the chip bond-pad is guarded with the active shield to reduce a parasitic capacitance of the chip bond-pad.

24. The sensor of claim 19, wherein at least one of the circuit elements connected to the sensor input comprises a bonding connection between a chip bond-pad on the substrate and one or more circuit components external to the integrated amplifier, and wherein said bonding connection is guarded with the active shield.

25. The sensor of claim 19, wherein the the package comprises a conductive portion that is connected to the active shield, thereby bootstrapping and shielding the integrated amplifier from external interference and parasitic capacitance.

26. The sensor of claim 19, wherein at least one of the circuit elements connected to the sensor input comprises an external connection between the sensor electrode and the integrated amplifier, and wherein the external connection is bootstrapped by the active shield.

27. The sensor of claim 19, wherein at least one of the circuit elements connected to the sensor input comprises a floating gate without conductive connections to the gate of the input transistor to sustainably eliminate a leakage current at the sensor input.

28. The sensor of claim 19, wherein at least one of the circuit elements connected to the sensor input comprises an electrostatic discharge (ESD) and biasing structure connected to the sensor input.

29. The sensor of claim 28, wherein the ESD and biasing structure comprise at least one diode, wherein the diode is bootstrapped by driving the diode with the active shield to maintain a potential difference of zero between the diode and the sensor input.

30. The sensor of claim 19, wherein the at least one sensor electrode comprises multiple electrodes, and further comprising:

a sensor body having a first surface and a second surface, wherein the multiple electrodes are disposed on the first surface and the sensor input, integrated amplifier and active shield are disposed on the second surface; and

wherein the multiple electrodes comprise at least two pairs of active electrodes and a reference electrode;

a differential amplifier connected to each pair of active electrodes for generating an output comprising a potential difference across the connected pair of active electrodes; and

wherein the potential difference across each pair of active electrodes is used to determine a local spatial electric field.

31. The sensor of claim 30, wherein an active electrode signal source comprises a shared active electrode that provides a shared input to each of at least two differential amplifiers, so that two or more pairs of active electrodes include the shared active electrode.

32. The sensor of claim 30, further comprising an inverter having an output connected to the reference electrode, wherein the reference electrode is actively driven with a signal obtained by inverting a combination of potentials registered by the electrodes.

33. The sensor of claim 30, wherein the combination of electrodes comprises at least two pairs of active electrodes, wherein each pair of active electrodes is connected to a corresponding differential amplifier.

34. The sensor of claim 33, wherein the at least two pairs of active electrodes are arranged in an orthogonal relationship.