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Routing signals via hinge assemblies for mobile computing devices

  • US 9,360,889 B2
  • Filed: 12/27/2013
  • Issued: 06/07/2016
  • Est. Priority Date: 12/27/2013
  • Status: Expired due to Fees
First Claim
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1. A device comprising:

  • a hinge assembly to rotatably couple a first housing to a second housing, wherein an interconnect extends through the hinge assembly as an incorporated portion of the hinge assembly, the interconnect to communicatively couple a component located in the first housing to a component located in a second housing;

    wherein the hinge assembly further comprises a first conductive material and the interconnect comprises a second conductive material, and wherein the interconnect is affixed to the hinge through lamination, a lamination material providing an insulating layer between the first conductive material and the second conductive material.

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