Cosmetic co-removal of material for electronic device surfaces

• US 9,363,905 B2
• Filed: 06/04/2010
• Issued: 06/07/2016
• Est. Priority Date: 02/02/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Myers, Scott, Heley, Richard, Theobald, Matthew, Stagnaro, Adam, Tan, Tang, Dinh, Richard, Pakula, David
• Primary Examiner(s): SAMPLE, DAVID R
• Application Number:
  US12/794,496
• Publication Number:
  US 20110186325A1
• Time in Patent Office: 2,195 Days
• Field of Search: 428/44, 428/45, 63/31, 63/32, 63/9, 63 151- 154, 63/156.5, 63/157
• US Class Current: 1/1
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/1658 related to the mounting of internal components, e.g. disc drive or any other functional module
• CPC Class Codes: G06F 1/1684 Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• CPC Class Codes: G06F 1/1698 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone details of antennas disposed inside a computer H01Q1/2266
• CPC Class Codes: H01Q 1/2258 used with computer equipment
• CPC Class Codes: H01Q 1/241 used in mobile communications, e.g. GSM H01Q1/247, H01Q1/248 take precedence
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0274 for an electrical connector module
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.

Claims

1. An electronic device component, comprising:

a rigid structural member forming a continuous external surface of an electronic device, defining a sidewall of the electronic device, and defining an internal volume for receiving at least a portion of the electronic device, the rigid structural member comprising;

a first element comprising an electrically conductive material and forming a first portion of the continuous exterior surface, the first element forming at least a portion of an antenna of an electrical circuit disposed within the internal volume;

a second element comprising an electrically conductive material and forming a second portion of the continuous exterior surface; and

an intermediate element providing an interlocking interface between the first element and the second element, the intermediate element formed from an electrically insulating material and forming a third portion of the continuous exterior surface.

2. The electronic device component of claim 1, wherein the first and second portions of the continuous external surface are smooth.

3. The electronic device component of claim 2, wherein the first and second portions of the continuous external surface define a single plane.

4. The electronic device component of claim 1, wherein the intermediate element is molded between the first and second elements.

5. The electronic device component of claim 1, wherein, the rigid structural member further comprises a third element having a U-shape.

6. The electronic device component of claim 1, wherein the intermediate element rigidly bonds the first element to the second element.

7. The electronic device component of claim 1, further comprising an adhesive between the intermediate element and the first and second elements.

8. The electronic device component of claim 1, wherein:

the intermediate element interlocks with the first element by at least partially filling an internal feature of the first element; and

the intermediate element interlocks with the second element by at least partially filling an internal feature of the second.

9. The electronic device component of claim 1, wherein:

the first element comprises a protrusion extending from an interior surface of the first element; and

the second element comprises a protrusion extending from an interior surface of the second element;

wherein

the protrusion of the first element and the protrusion of the second element each at least partially engage the intermediate element.

10. An outer periphery member of an electronic device, comprising:

a rigid structural member defining an internal volume for enclosing an electronic circuit of the electronic device and forming a sidewall of the electronic device, the rigid structural member comprising;

a first element defining a first exterior face of the electronic device and defining a first cavity formed within a first interior surface of the first element, the first element forming at least a portion of an antenna of the electronic circuit;

a second element defining a second exterior face of the electronic device and defining a second cavity formed within a second interior surface of the second element; and

an intermediate element comprising an insulating material positioned at least partially within a gap between the first element and second element and coupled to the first cavity and the second cavity thereby forming an interlocking interface between the first element and the second element.

11. The outer periphery member of claim 10, wherein the first cavity is substantially cylindrical.

12. The electronic device of claim 11, wherein the first rigid structural element comprises an antenna of an electrical circuit disposed within the interior volume.

13. The electronic device of claim 11, wherein:

the first interior surface is defined, at least in part, by a protrusion extending from the first rigid structural element; and

wherein

the first undercut is defined at least partially within the protrusion.

14. The outer periphery member of claim 10, wherein the intermediate element is formed from plastic.

15. An electronic device component, comprising:

a structural member forming a sidewall of the electronic device and forming at least a portion of an interior volume of the electronic device, the structural member comprising;

a first rigid structural element defining a first undercut in a first interior surface of the first rigid structural element;

a second rigid structural element defining a second undercut in a second interior surface of the second rigid structural element;

an intermediate element positioned in a gap between the first rigid structural element and the second rigid structural element and forming at least a portion of a continuous exterior surface of the electronic device;

wherein the intermediate element is engaged with the first and second undercuts.