Semiconductor device and driving method thereof

• US 9,368,059 B2
• Filed: 02/24/2014
• Issued: 06/14/2016
• Est. Priority Date: 03/01/2013
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Takemura, Yasuhiko
• Primary Examiner(s): Watko, Julie Anne
• Application Number:
  US14/188,029
• Publication Number:
  US 20140247254A1
• Time in Patent Office: 841 Days
• Field of Search: 345/204
• US Class Current: 1/1
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0421 by interrupting or reflecting a light beam, e.g. optical touch-screen
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: G06F 3/046 by electromagnetic means
• CPC Class Codes: G09G 3/2092 Details of a display terminals using a flat panel, the details relating to the control arrangement of the display terminal and to the interfaces thereto suitable for both CRT and flat panel G09G5/003; specific for a CRT G09G1/165
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]

Abstract

A semiconductor device having a novel data input and output panel with high definition is provided. A method for driving the semiconductor device having the novel data input and output panel with high definition is provided. The data input and output panel includes, over a substrate, proximity sensors, signal lines electrically connected to the proximity sensors, and pixels electrically connected to the signal lines. The signal lines can supply image signals to the pixels, can supply control signals to the proximity sensors, and can be supplied with sensing signals from the proximity sensors.

Claims

1. A semiconductor device comprising:

a display portion having first and second pixels over a substrate, the first and second pixels being directly connected to a first gate signal line;

a proximity sensor adjacent to the first and second pixels and the first gate signal line in the display portion;

a first signal line directly connected to the proximity sensor and the first pixel; and

,

a second signal line directly connected to the proximity sensor and the second pixel,

wherein the first signal line is configured to supply a first image signal to the first pixel and to be supplied with a sensing signal from the proximity sensor, and

wherein the second signal line is configured to supply a second image signal to the second pixel and to supply a control signal to the proximity sensor.

2. The semiconductor device according to claim 1, wherein the proximity sensor comprises:

a first transistor having;

a gate electrode electrically connected to the second signal line; and

a first electrode electrically connected to a wiring configured to supply a common potential to the proximity sensor;

a second transistor having;

a gate electrode electrically connected to a second electrode of the first transistor;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to the first signal line; and

a photoelectric conversion element having;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to the second electrode of the first transistor.

3. The semiconductor device according to claim 1, further comprising:

a selection circuit electrically connected to the first and second signal lines;

a proximity sensor driver circuit electrically connected to the selection circuit; and

a pixel driver circuit electrically connected to the proximity sensor driver circuit.

4. The semiconductor device according to claim 3, wherein the selection circuit is configured to supply the first and second image signals to the first and second signal lines, respectively, to supply the control signal to the second signal line, and to be supplied with the sensing signal from the first signal line.

5. A semiconductor device comprising:

a display portion having first and second pixels over a substrate, the first and second pixels being directly connected to a first gate signal line;

a first proximity sensor in the display portion;

a first signal line directly connected to the first proximity sensor and the first pixel; and

a second signal line directly connected to the first proximity sensor and the second pixel,

wherein the first signal line is configured to supply a first image signal to the first pixel and to be supplied with a sensing signal from the first proximity sensor, and

wherein the second signal line is configured to supply a second image signal to the second pixel and to supply a control signal to the first proximity sensor.

6. The semiconductor device according to claim 5, wherein the first proximity sensor comprises:

a first transistor having;

a gate electrode electrically connected to the second signal line; and

a first electrode electrically connected to a wiring configured to supply a common potential to the first proximity sensor;

a second transistor having;

a gate electrode electrically connected to a second electrode of the first transistor;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to the first signal line; and

a photoelectric conversion element having;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to the second electrode of the first transistor.

7. The semiconductor device according to claim 5, further comprising:

a circuit configured to supply the first and second image signals to the first and second signal lines, respectively, to supply the control signal to the second signal line, and to be supplied with the sensing signal from the first signal line;

a proximity sensor driver circuit electrically connected to the circuit; and

a pixel driver circuit electrically connected to the proximity sensor driver circuit.

8. The semiconductor device according to claim 5, further comprising a second proximity sensor electrically connected to the second signal line.

9. A semiconductor device comprising:

a display portion having first, second, and third pixels over a substrate, the first second, and third pixels being directly connected to a first gate signal line;

a first proximity sensor in the display portion;

a first signal line directly connected to the first proximity sensor and the first pixel;

a second signal line directly connected to the first proximity sensor and the second pixel; and

a third signal line directly connected to the first proximity sensor and the third pixel,

wherein the first signal line is configured to supply a first image signal to the first pixel and to be supplied with a sensing signal from the first proximity sensor,

wherein the second signal line is configured to supply a second image signal to the second pixel and to supply a first control signal to the first proximity sensor, and

wherein the third signal line is configured to supply a third image signal to the third pixel and to supply a second control signal to the first proximity sensor.

10. The semiconductor device according to claim 9, wherein the first proximity sensor comprises:

a first transistor having;

a gate electrode electrically connected to the second signal line; and

a first electrode electrically connected to a wiring configured to supply a common potential to the first proximity sensor;

a second transistor having;

a gate electrode electrically connected to a second electrode of the first transistor;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to the first signal line;

a third transistor having;

a gate electrode electrically connected to the third signal line; and

a first electrode electrically connected to the second electrode of the first transistor; and

a photoelectric conversion element having;

a first electrode electrically connected to the wiring; and

a second electrode electrically connected to a second electrode of the third transistor.

11. The semiconductor device according to claim 9, further comprising:

a circuit configured to supply the first, second, and third image signals to the first, second, and third signal lines, respectively, to supply the first and second control signals to the second and third signal lines, respectively, and to be supplied with the sensing signal from the first signal line;

a proximity sensor driver circuit electrically connected to the circuit; and

a pixel driver circuit electrically connected to the proximity sensor driver circuit.

12. The semiconductor device according to claim 9, further comprising:

a second proximity sensor electrically connected to the second signal line; and

a third proximity sensor electrically connected to the third signal line.

13. A method for driving a semiconductor device comprising a display portion having first and second pixels and a proximity sensor, the method comprising the steps of:

supplying a first image signal to the first pixel from a pixel driver circuit via a selection circuit and a first signal line;

supplying a second image signal to the second pixel from the pixel driver circuit via the selection circuit and a second signal line;

supplying a control signal to the proximity sensor from the selection circuit via the second signal line; and

acquiring a sensing signal supplied from the proximity sensor via the selection circuit and the first signal line.