Imaging structure with embedded light sources
First Claim
1. An imaging structure, comprising:
- a silicon backplane with a driver pad array;
embedded light sources formed on the driver pad array in sections of an emitter material layer, the embedded light sources configured for individual control at the driver pad array to generate and emit light, the emitter material layer having a same length and width as the silicon backplane with the driver pad array; and
a conductive material layer over the embedded light sources forms a p-n junction between the emitter material layer and the conductive material layer, the conductive material layer having the same length and width as the silicon backplane with the driver pad array and the emitter material layer.
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Accused Products
Abstract
In embodiments of an imaging structure with embedded light sources, an imaging structure includes a silicon backplane with a driver pad array. The embedded light sources are formed on the driver pad array in an emitter material layer, and the embedded light sources can be individually controlled at the driver pad array to generate and emit light. A conductive material layer over the embedded light sources forms a p-n junction between the emitter material layer and the conductive material layer. Micro lens optics can be positioned over the conductive material layer to direct the light that is emitted from the embedded light sources. Further, the micro lens optics may be implemented as parabolic optics to concentrate the light that is emitted from the embedded light sources.
349 Citations
20 Claims
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1. An imaging structure, comprising:
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a silicon backplane with a driver pad array; embedded light sources formed on the driver pad array in sections of an emitter material layer, the embedded light sources configured for individual control at the driver pad array to generate and emit light, the emitter material layer having a same length and width as the silicon backplane with the driver pad array; and a conductive material layer over the embedded light sources forms a p-n junction between the emitter material layer and the conductive material layer, the conductive material layer having the same length and width as the silicon backplane with the driver pad array and the emitter material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method, comprising:
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forming a silicon backplane with a driver pad array that individually controls embedded light sources; forming the embedded light sources as direct emitters on the driver pad array in sections of an emitter material layer, the embedded light sources formed as individual emitters in the emitter material layer to approximate parabolic reflection that directs reflected light from within an individual emitter, the emitter material layer having a same length and width as the silicon backplane with the driver pad array; forming a conductive material layer over the embedded light sources, the conductive material layer having the same length and width as the silicon backplane with the driver pad array and the emitter material layer; and directing light that is emitted from the embedded light sources with micro lens optics that are positioned over the conductive material layer. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A wearable display device, comprising:
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left and right display lens systems configured for augmented reality imaging; left and right imaging units of the respective left and right display lens systems configured to generate an augmented reality image; each of the left and right imaging units including an imaging structure that comprises; a silicon backplane with a driver pad array configured to individually control embedded light sources that are formed as direct emitters on the driver pad array in sections of an emitter material layer; a conductive material layer over the embedded light sources, the conductive material layer forming a p-n junction between the emitter material layer and the conductive material layer, the conductive material layer having a same length and width as the silicon backplane, the driver pad array, and the emitter material layer; and micro lens optics over the conductive material layer to direct light that is emitted from the embedded light sources. - View Dependent Claims (19, 20)
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Specification