Energy supply device for explosion-proof electronic functional units
First Claim
Patent Images
1. An energy supply device for explosion-proof electronic functional units, comprising:
- at least one inductor connected to supply an associated functional unit with a high-frequency AC voltage;
at least one multi-level printed circuit board; and
a distribution printed circuit board,wherein the at least one inductor is formed as a substantially congruent conductor track of the at least one multi-level printed circuit board, the conductor tracks are connected to one another on the at least one multi-level printed circuit board,wherein the at least one multi-level printed circuit board is arranged vertically on a distribution printed circuit board, andwherein a number of metallization planes of the at least one multi-level printed circuit board is greater than a number of metallization planes of the distribution printed circuit board.
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Abstract
An exemplary energy supply device for explosion-proof electronic functional units supplies each functional unit with a high-frequency AC voltage via an inductor. The inductors are formed as substantially congruent conductor tracks of a multi-level printed circuit board, which can be connected to one another and arranged vertically on a distribution printed circuit board. The number of metallization planes of the multi-level printed circuit board being greater than the number of metallization planes of the distribution printed circuit board.
18 Citations
6 Claims
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1. An energy supply device for explosion-proof electronic functional units, comprising:
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at least one inductor connected to supply an associated functional unit with a high-frequency AC voltage; at least one multi-level printed circuit board; and a distribution printed circuit board, wherein the at least one inductor is formed as a substantially congruent conductor track of the at least one multi-level printed circuit board, the conductor tracks are connected to one another on the at least one multi-level printed circuit board, wherein the at least one multi-level printed circuit board is arranged vertically on a distribution printed circuit board, and wherein a number of metallization planes of the at least one multi-level printed circuit board is greater than a number of metallization planes of the distribution printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification