Acoustic resonator having collar structure

• US 9,401,692 B2
• Filed: 10/29/2012
• Issued: 07/26/2016
• Est. Priority Date: 10/29/2012
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Burak, Dariusz, Shirakawa, Alexandre, Choy, John, Nikkel, Phil
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): SALAZAR JR, JORGE L
• Application Number:
  US13/663,449
• Publication Number:
  US 20140118091A1
• Time in Patent Office: 1,366 Days
• Field of Search: 333/133, 333186-191, 310/324, 310/365, 310/312
• US Class Current: 1/1
• CPC Class Codes: H03H 9/02118 of lateral leakage between adjacent resonators
• CPC Class Codes: H03H 9/02157 Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
• CPC Class Codes: H03H 9/132 characterized by a particular shape
• CPC Class Codes: H03H 9/173 Air-gaps

Abstract

A bulk acoustic wave (BAW) resonator structure comprises a first electrode disposed over a substrate, a first piezoelectric layer disposed over the first electrode, a second electrode disposed over the first piezoelectric layer, and a collar structure disposed around a perimeter of an active region defined by an overlap between the first electrode, the second electrode, and the piezoelectric layer.

Claims

1. A bulk acoustic wave (BAW) resonator structure, comprising:

a substrate comprising a trench;

a first electrode disposed over the substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer;

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region, which is defined by an overlap between the first electrode, the second electrode, the piezoelectric layer, and the trench; and

a first planarization layer formed on the piezoelectric layer adjacent to the second electrode, the first planarization layer comprising a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

2. The BAW resonator structure of claim 1, wherein the collar structure is formed over a first planarization layer and the second electrode.

3. The BAW resonator structure of claim 1, wherein the first layer comprises silicon carbide and the second layer comprises non-etchable borosilicate glass.

4. The BAW resonator structure of claim 1, wherein the collar structure has an inner edge that extends into the active region.

5. The BAW resonator structure of claim 1, wherein the collar structure further comprises an integrated frame.

6. The BAW resonator structure of claim 1, wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

7. The BAW resonator structure of claim 1, wherein the collar structure is formed on the first electrode.

8. The BAW resonator structure of claim 1, wherein the collar structure is formed between the first electrode and the piezoelectric layer.

9. The BAW resonator structure of claim 8, wherein the dielectric material comprises carbon doped silicon oxide.

10. The BAW resonator structure of claim 1, wherein the collar structure is formed between the substrate and the first electrode.

11. The BAW resonator structure of claim 1, wherein the trench comprises an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

12. The BAW resonator structure of claim 11, further comprising a second planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the second planarization layer and the first electrode.

13. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a first piezoelectric layer disposed over the first electrode;

a second electrode disposed over the first piezoelectric layer; and

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region which is defined by an overlap between the first electrode, the second electrode and the piezoelectric layer, the collar structure having an inner edge that is substantially aligned with an outer edge of the second electrode, wherein the collar structure is disposed on the first electrode, or between the first electrode and the piezoelectric layer.

14. The BAW resonator structure of claim 13, further comprising an acoustic mirror formed between the first electrode and the substrate.

15. The BAW resonator structure of claim 13, wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

16. The BAW resonator structure of claim 13, wherein the dielectric material comprises carbon doped silicon oxide.

17. The BAW resonator structure of claim 13, further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

18. The BAW resonator structure of claim 13, wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

19. The BAW resonator structure of claim 18, wherein the collar structure is disposed on the first electrode and the BAW resonator structure further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

20. The BAW resonator structure of claim 13, wherein the collar structure further comprises an integrated frame.

21. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region which is defined by an overlap between the first electrode, the second electrode and the piezoelectric layer, the collar structure having a cutoff frequency that is substantially the same as a cutoff frequency of the active region.

22. The BAW resonator structure of claim 21, wherein the collar structure has an inner edge that extends into the active region.

23. The BAW resonator structure of claim 21, further comprising an acoustic mirror formed between the first electrode and the substrate.

24. The BAW resonator structure of claim 21, wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

25. The BAW resonator structure of claim 21, wherein the collar structure is formed on the first electrode.

26. The BAW resonator structure of claim 21, wherein the collar structure is formed between the first electrode and the piezoelectric layer.

27. The BAW resonator structure of claim 26, wherein the dielectric material comprises carbon doped silicon oxide.

28. The BAW resonator structure of claim 21, wherein the collar structure is formed between the substrate and the first electrode.

29. The BAW resonator structure of claim 21, wherein the collar structure further comprises an integrated frame.

30. The BAW resonator structure of claim 21, further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

31. The BAW resonator structure of claim 21, wherein the collar structure is formed over a planarization layer formed on the piezoelectric layer and the second electrode.

32. The BAW resonator structure of claim 31, wherein the planarization layer comprises a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

33. The BAW resonator structure of claim 32, wherein the first layer comprises silicon carbide and the second layer comprises non-etchable borosilicate glass.

34. The BAW resonator structure of claim 21, wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

35. The BAW resonator structure of claim 34, further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

36. A bulk acoustic wave (BAW) resonator structure, comprising:

a substrate comprising a trench;

a first electrode disposed over the substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a collar structure disposed around a perimeter of an active region, which is defined by an overlap between the first electrode, the second electrode, the piezoelectric layer, and the trench, wherein the collar structure comprises a region of dielectric material having a predetermined thickness and width, and having a cutoff frequency substantially matched to a cutoff frequency of the active region.

37. The BAW resonator structure of claim 36, wherein the collar structure has an inner edge that extends into the active region.

38. The BAW resonator structure of claim 36, wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

39. The BAW resonator structure of claim 36, wherein the dielectric material comprises carbon doped silicon oxide.

40. The BAW resonator structure of claim 36, wherein the collar structure is formed between the substrate and the first electrode.

41. The BAW resonator structure of claim 36, further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

42. The BAW resonator structure of claim 36, wherein the collar structure is formed over a planarization layer and the second electrode.

43. The BAW resonator structure of claim 42, wherein the planarization layer comprises a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

44. The BAW resonator structure of claim 36, wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

45. The BAW resonator structure of claim 44, further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

46. The BAW resonator structure of claim 36, wherein the collar structure further comprises an integrated frame.