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Thermal management for head-worn computer

  • US 9,423,842 B2
  • Filed: 09/18/2014
  • Issued: 08/23/2016
  • Est. Priority Date: 09/18/2014
  • Status: Active Grant
First Claim
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1. A head-worn computer, comprising:

  • an upper compartment adapted to contain a processor, a memory, and a sensor system, the upper compartment positioned above a lens assembly and including a top plate comprising;

    a processor connection pad mechanically adapted to facilitate the connection between the processor and the top plate;

    a plurality of heat dissipation fins adapted to dissipate heat received from the processor, wherein the top plate, a thermally conductive material, and the processor connection pad cause the top plate to operate at less than 70 degrees C. when the processor is operated and the head-worn computer is in an environment of approximately 55 degrees C. or less, wherein the thermally conductive material is positioned between the processor connection pad and the processor to reduce an air gap and to further facilitate the thermal connection between the processor and the top plate; and

    a first arm and a second arm adapted to secure the upper compartment on a user'"'"'s head, each of the two arms comprising a battery compartment and battery connections for the powering of the processor, the memory and the sensor system.

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