Wafer-scale package including power source

• US 9,431,312 B2
• Filed: 03/24/2016
• Issued: 08/30/2016
• Est. Priority Date: 10/26/2010
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Day, John K, Mattes, Michael F, Grief, Malcolm K, O'Brien, Richard J, Gerrish, Paul F, Ruben, David A
• Primary Examiner(s): Geyer, Scott B
• Application Number:
  US15/079,957
• Publication Number:
  US 20160204004A1
• Time in Patent Office: 159 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/01 Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue clinical contact thermometers G01K13/20
• CPC Class Codes: A61B 5/03 Detecting, measuring or recording fluid pressure within the body other than blood pressure, e.g. cerebral pressure; Measuring pressure in body tissues or organs A61B5/205 takes precedence
• CPC Class Codes: A61B 5/11 Measuring movement of the entire body or parts thereof, e.g. head or hand tremor, mobility of a limb for measuring pulse A61B5/02 ;A61B5/1038 takes precedence; motion detection to correct for motion artifacts in physiological signals A61B5/721
• CPC Class Codes: A61N 1/37211 Means for communicating with stimulators
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/12 Mountings, e.g. non-detachable insulating substrates
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Claims

1. A method comprising:

connecting a control module to one of a first substrate and a second substrate, wherein the first substrate includes at least one of a first semiconductor material and a first insulating material, wherein the second substrate includes at least one of a second semiconductor material and a second insulating material, and wherein the control module is configured to one of determine a physiological parameter of a patient and deliver electrical therapy to the patient;

connecting an energy storage device to one of the first and second substrates;

interfacing the first and second substrates such that the first and second substrates define an enclosed cavity between the first and second substrates, the enclosed cavity including the control module and the energy storage device; and

heating an interface between the first and second substrates to form a bond between the first and second substrates.

2. The method of claim 1, wherein heating the interface includes heating at least a portion of the interface using a laser directed at the interface.

3. The method of claim 1, wherein the first substrate includes a glass substrate, the second substrate includes a glass substrate, and one of the first and second substrates includes a light absorbing layer at the interface.

4. The method of claim 3, wherein the light absorbing layer absorbs light at a wavelength that is transmitted by one of the first and second substrates.

5. The method of claim 3, wherein heating the interface includes heating at least a portion of the light absorbing layer using a laser directed at the light absorbing layer.

6. The method of claim 1, wherein the first substrate includes a glass substrate and the second substrate includes a semiconductor substrate.