Method for manufacture of multi-layer wire structure for high efficiency wireless communication

• US 9,444,213 B2
• Filed: 10/21/2013
• Issued: 09/13/2016
• Est. Priority Date: 03/09/2009
• Status: Active Grant

• Current Assignee: Nucurrent, Inc.
• Original Assignee: Nucurrent, Inc.
• Inventors: Singh, Vinit, Frysz, Christine A., Geary, Matthew, Babcock, Eitan, Derbas, Justin, Peralta, Alberto
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US14/059,100
• Publication Number:
  US 20140047713A1
• Time in Patent Office: 1,058 Days
• US Class Current: 1/1
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01R 43/20 for assembling or disassembling contact members with insulating base, case or sleeve
• CPC Class Codes: Y10T 29/49195 with end-to-end orienting

Abstract

A structure for wireless communication having a plurality of insulator layers, a conductor layer separating each of the insulator layers, and at least one connector connecting two conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Claims

1. A method of manufacturing a wire structure, the method comprising:

a) forming a plurality of first insulators;

b) forming a plurality of first conductors, each first conductor having a conductor thickness and a conductor skin depth residing within the conductor thickness, wherein the first conductor thickness is about the same or greater than a skin depth thickness; and

c) positioning each first conductor between each of the plurality of first insulators, thereby forming the wire structure having a plurality of alternating first conductors and first insulators so that the wire structure is capable of propagating an electrical signal through the skin depth within the first conductor.

2. The method of claim 1, including forming at least one connector connecting at least two of the first conductors.

3. The method of claim 1, including providing the first conductor comprising at least one conductor layer.

4. The method of claim 3, including selecting the at least one conductor layer from the group consisting of a conductive tape, a conductive ribbon, and a deposited metal.

5. The method of claim 2, including selecting the connector from the group consisting of a via, a solder, a tab, a wire, a pin, and a rivet.

6. The method of claim 1, including positioning each of the plurality of first conductors in a parallel orientation.

7. The method of claim 1, including providing the number of the plurality of first conductors less than or greater than the total number of first insulators.

8. The method of claim 1, including electrically connecting at least 2 of the plurality of first conductors in series.

9. The method of claim 1, including electrically connecting a plurality of second conductors in series or parallel with one or more of the first conductors.

10. The method of claim 1, including providing at least one of the plurality of first conductors a cross-sectional shape selected the group consisting of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an elliptical cross-section.

11. The method of claim 1, including providing the wire structure a structural shape selected from the group consisting of a circular solenoidal configuration, a square solenoidal configuration, a circular spiral configuration, a square spiral configuration, a rectangular configuration, a triangular configuration, a circular spiral-solenoidal configuration, a square spiral-solenoidal configuration, and a conformal solenoid configuration.

12. The method of claim 1, including forming at least one first conductor from an electrically conductive material.

13. The method of claim 12, including selecting the electrically conductive material from the group consisting of copper, titanium, platinum, a platinum/iridium alloy, tantalum, niobium, zirconium, hathium, nitinol, a Co—

Cr—

Ni alloy, stainless steel, gold, a gold alloy, palladium, carbon, silver, a noble metal, a biocompatible material and combinations thereof.

14. The method of claim 1, including forming the insulator from an electrically insulative material.

15. The method of claim 14, including selecting the electrically insulative material from the group consisting of air, polystyrene, silicon dioxide, a biocompatible ceramic material, a non-conductive dielectric material, a ferrite material and combinations thereof.

16. The method of claim 1, including forming the insulator using a process technique selected from the group consisting of a deposition technique, a physical deposition technique , and a physical vapor deposition technique.

17. The method of claim 1, including forming the conductor by depositing a conductive material through a mask.

18. The method of claim 1, including providing the wire structure a fixed flexible structure, a flexible structure, a rigid structure, or combinations thereof.

19. The method of claim 1, including electrically connecting the wire structure to a circuit element selected from the group consisting of a resistor, an inductor, a capacitor and combinations thereof.

20. The method of claim 1, including selecting the electrical signal from the group consisting of an electrical voltage, an electrical current, a data signal, and combinations thereof.