Passively athermalized infrared imaging system and method of manufacturing same

• US 9,448,338 B2
• Filed: 01/20/2012
• Issued: 09/20/2016
• Est. Priority Date: 01/20/2011
• Status: Active Grant

• Current Assignee: Snap, Inc.
• Original Assignee: Fivefocal, LLC
• Inventors: Kubala, Kenneth Scott, Baron, Alan E., Bates, Robert Matthew
• Primary Examiner(s): Won, Bumsuk
• Assistant Examiner(s): Washington, Tamara Y
• Application Number:
  US13/355,474
• Publication Number:
  US 20120188634A1
• Time in Patent Office: 1,705 Days
• Field of Search: 359/356
• US Class Current: 1/1
• CPC Class Codes: G02B 3/0062 Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
• CPC Class Codes: G02B 7/003 Alignment of optical elements G02B7/001, G02B7/002 take precedence; for mirrors G02B7/1822
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

In an embodiment, a method of aligning elements in a manufacturing process includes placing a middle element onto a base element, the base element forming first alignment features, the middle element forming apertures therethrough corresponding to the first alignment features. The method also includes placing second alignment features of an upper element onto the first alignment features such that the first and second alignment features cooperate, through the apertures, to align the upper element with the base element. An infrared lens assembly includes a lens formed of an infrared transmitting material that is disposed within a carrier of a base material, the lens being molded within the carrier with at least one feature that secures the lens to the carrier.

Claims

1. A method of aligning upper and lower wafers, the lower wafer having a plurality of first optical elements each respectively opposing one of a plurality of second optical elements of the upper wafer, and the lower wafer having a plurality of first alignment features each respectively opposing one of a plurality of second alignment features of the upper wafer, the method comprising:

positioning a spacer wafer, the spacer wafer having a plurality of alignment apertures each respectively corresponding one of the plurality of first alignment features, on the lower wafer such that the plurality of alignment apertures align with the plurality of first alignment features;

inserting, after the step of positioning, one of a plurality of alignment elements within the each of the alignment apertures;

arranging the upper wafer on the spacer wafer such that the upper and lower wafers passively align via the plurality of alignment elements;

wherein the first alignment features, and the respective first and second alignment features cooperate to passively align the upper wafer to the lower wafer in at least four degrees of freedom, the four degrees of freedom including;

X- and Y-coordinates defining centering of each one of the plurality of first optical elements to a respective one of the plurality of second optical elements, a Z-coordinate defining spacing between the lower wafer and the upper wafer, and rotation of the lower wafer with respect to the upper wafer.

2. The method of claim 1, wherein the plurality of first and/or second alignment features are protrusions from each respective lower and/or upper wafer and serve as the plurality of alignment elements.

3. The method of claim 1, the plurality of first and second alignment features including conical indentations, spherical indentations, oval features, oblong features, grooves, radial grooves, and/or semispherical depressions of the lower and upper wafers.

4. The method of claim 1, the step of arranging including positioning the upper wafer such that the plurality of first and second alignment features respectively make contact to a respective one of the plurality of alignment elements.

5. The method of claim 1, the alignment elements having a first width that is smaller than a second width of the alignment apertures of the spacer wafer.

6. The method of claim 1, the plurality of first alignment features, the plurality of second alignment features and the plurality of alignment apertures all being spaced apart near respective edges of the lower wafer, upper wafer, and spacer wafer, respectively.

7. The method of claim 6, wherein the plurality of first alignment features, the plurality second alignment features and the plurality of alignment apertures are spaced apart to substantially form points of an equilateral triangle along a plane of each of the lower wafer, upper wafer and spacer wafer, respectively.

8. The method of claim 1, further comprising the step of forming a plurality of optical element apertures within the spacer wafer respectively corresponding to the opposing plurality of first and second optical elements.

9. The method of claim 8, the spacer wafer including an optically opaque material chosen from the materials consisting of metal, plastic, ceramic and/or composite materials, the optically opaque material being opaque to infrared (IR) wavelengths.

10. The method of claim 4, the optical element apertures (i) allowing mechanical clearance between opposing ones of the first and second lenses of the lower and upper wafers, respectively, and/or (ii) allowing infrared and/or visible radiation to pass, without refraction or absorption, between opposing ones of the first and second optical elements of the lower and upper wafers.

11. The method of claim 9, the optically opaque material being opaque to long wave infrared (LWIR) wavelengths.

12. The method of claim 1, each of the plurality of alignment elements being spherical.

13. The method of claim 1, each of the plurality of alignment elements having a first thickness that is at least as great as a second thickness of the spacer wafer.

14. The method of claim 1 further comprising the step of bonding, adhering, welding and/or soldering one or more of the lower wafer, upper wafer, and spacer wafer to immobilize the wafers with respect to one another to form an array of lens and spacer sets.

15. The method of claim 14, further comprising the step of dicing the array of lens and spacer sets to form individual lens and spacer sets.

16. The method of claim 15, each of the individual lens and spacer set including one of the first optical elements, one of the second optical elements and a portion of the spacer wafer.

17. The method of claim 16, the portion of the spacer wafer including an optical element aperture.

18. An alignment apparatus comprising:

a lower wafer having a plurality of first optical elements and a plurality of first alignment features;

an upper wafer having a plurality of second optical elements, each of the second optical elements respectively opposing one of the plurality of first optical elements, and the upper wafer further having a plurality of second alignment features respectively corresponding to the first alignment features on the lower wafer;

a spacer wafer, located between the lower and upper wafers, having a plurality of alignment apertures completely therethrough, each of the plurality of alignment apertures completely enclosed by the spacer wafer; and

,

a plurality of alignment elements, each respectively located within individual ones of the plurality of alignment apertures;

wherein the alignment elements, the first alignment features, and the second alignment features cooperate to passively align the upper wafer to the lower wafer in at least four degrees of freedom, the four degrees of freedom including;

X- and Y-coordinates defining centering of each one of the plurality of first optical elements to a respective one of the plurality of second optical elements,

a Z-coordinate defining spacing between the lower wafer and the upper wafer, and

rotation of the lower wafer with respect to the upper wafer.

19. The alignment apparatus of claim 18, characterized by one or more of the following:

the lower wafer having a substantially planar upper surface,

the upper wafer having a substantially planar lower surface, and

the spacer wafer having substantially planar counterfacing surfaces.

20. The alignment apparatus of claim 18, the spacer wafer having a plurality of optical element apertures for at least one of:

(i) mechanical clearance for one or more of the plurality of first and second optical elements, and

(ii) allowing at least one of IR and visible radiation to pass between opposing ones of the first and second optical elements without absorption.

21. The alignment apparatus of claim 20, the optical element apertures being at least one of rounded rectangles, circles, and other shapes respectively matched to an optically active area of the plurality of first and second optical elements.

22. The alignment apparatus of claim 20, the spacer wafer including metal, plastic, ceramic or composite materials that are optically opaque to IR radiation wavelengths.

23. The alignment apparatus of claim 18, the spacer wafer including a solid piece of IR transparent material.

24. The alignment apparatus of claim 18, wherein each of the plurality of alignment elements is in contact with both of a corresponding first alignment feature and second alignment feature when the lower wafer, spacer wafer and upper wafer are stacked on top of one another.

25. The alignment apparatus of claim 18, wherein each of the plurality of alignment elements has a maximum width that is smaller than a respective second minimum width of the plurality of alignment apertures.

26. The alignment apparatus of claim 18, the plurality of first and second alignment features including at least one of conical indentations, spherical indentations, oval features, oblong features, grooves, radial grooves, and semispherical depressions within the lower and/or upper wafers, respectively.

27. The alignment apparatus of claim 18, the plurality of first and second alignment features and the plurality of alignment apertures being spaced near the periphery of the lower wafer, upper wafer and spacer wafer, respectively.

28. The alignment apparatus of claim 18, the plurality of first and second alignment features and the plurality of alignment apertures each comprising three first and second alignment features and three alignment apertures, respectively, the three first and second alignment features and three alignment apertures being spaced apart to form points of a virtual an equilateral triangle in planes of each of the lower, upper and spacer wafers, respectively.

29. The alignment apparatus of claim 18, each of the plurality of alignment elements having a first thickness that is at least as great as a second thickness of the spacer wafer.

30. The alignment apparatus of claim 18, further comprising at least one of an adhesive, bonding material, weld, and solder for immobilizing the lower, spacer and upper wafers with respect to one another.

31. The alignment apparatus of claim 18, the plurality of first and second alignment features including different ones of alignment features chosen from the group including conical indentations, spherical indentations, oval features, oblong features, grooves, radial grooves, and semispherical depressions.

32. An apparatus for forming an athermalized infrared imaging system, the apparatus comprising:

a lower wafer having a plurality of first optical elements and a plurality of first alignment features;

an upper wafer having a plurality of second optical elements, each of the second optical elements respectively opposing one of the plurality of second optical elements, each of the optical elements respectively opposing one of the plurality of first optical elements, and the upper wafer further having a plurality of second alignment features respectively corresponding to the first alignment features on the lower wafer;

whereby the lower and upper wafers are passively aligned via alignment elements located within alignment apertures of a spacer wafer, and the lower, upper and spacer wafers are diced such that the infrared optical imaging system formed therefrom is athermalized;

wherein the first alignment features, and the respective first and second alignment features cooperate to passively align the upper wafer to the lower wafer in at least four degrees of freedom, the four degrees of freedom including;

X- and Y-coordinates defining centering of each one of the plurality of first optical elements to a respective one of the plurality of second optical elements, a Z-coordinate defining spacing between the lower wafer and the upper wafer, and rotation of the lower wafer with respect to the upper wafer.