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Thin-film devices and fabrication

  • US 9,454,053 B2
  • Filed: 12/10/2012
  • Issued: 09/27/2016
  • Est. Priority Date: 12/12/2011
  • Status: Active Grant
First Claim
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1. A method of fabricating an optical device comprising one or more material layers sandwiched between a first and a second conducting layer, the method comprising:

  • (i) receiving a substrate comprising the first conducting layer over its work surface;

    (ii) removing a first width of the first conducting layer at the periphery of the substrate and along between about 10% and about 90% of the perimeter of the substrate;

    (iii) depositing said one or more material layers of the optical device and the second conducting layer such that they cover the first conducting layer and extend beyond the first conducting layer into the first width at the periphery of the substrate;

    (iv) removing a second width, narrower than the first width, of all the layers at the periphery of the substrate along substantially the entire perimeter of the substrate, wherein the depth of removal is at least sufficient to remove the first conducting layer;

    (v) removing at least one portion of the second transparent conducting layer and the one or more layers of the optical device thereunder, thereby revealing at least one exposed portion of the first conducting layer; and

    (vi) applying a bus bar to said at least one exposed portion of the first transparent conducting layer, wherein at least one of the first and second conducting layers is transparent.

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