Pane having an electrical connection element

• US 9,484,651 B2
• Filed: 07/24/2013
• Issued: 11/01/2016
• Est. Priority Date: 08/24/2012
• Status: Active Grant

• Current Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Original Assignee: Saint-Gobain Glass France (Compagnie De Saint-Gobain)
• Inventors: Rateiczak, Mitja, Reul, Bernhard, Schmalbuch, Klaus
• Primary Examiner(s): FUQUA, SHAWNTINA T
• Application Number:
  US14/421,993
• Publication Number:
  US 20150236438A1
• Time in Patent Office: 1,196 Days
• US Class Current: 1/1
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 35/26 with the principal constituent melting at less than 400 degrees C
• CPC Class Codes: H01R 13/02 Contact members
• CPC Class Codes: H01R 43/02 for soldered or welded connections
• CPC Class Codes: H01R 43/0235 for applying solder H01R43/0228 takes precedence
• CPC Class Codes: H05B 3/06 Heater elements structurally combined with coupling elements or holders
• CPC Class Codes: H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

A pane having a connection element, having; a substrate having an electrically conductive structure on at least a subregion of the substrate, the electrical connection element on at least a subregion of the electrically conductive structure, and a lead-free soldering compound which connects the electrical connection element to the electrically conductive structure in at least a subregion, wherein the lead-free soldering compound contains 58 to 62% by weight indium, 35 to 38% by weight tin, 1 to 3.5% by weight silver and 0.5 to 2% by weight copper.

Claims

1. A pane with at least one connection element at least comprising:

a substrate with an electrically conductive structure on at least one subregion of the substrate,

at least one electrical connection element on at least one subregion of the electrically conductive structure, and

a leadfree soldering compound, which connects the electrical connection element to the electrically conductive structure in at least one subregion,

wherein the leadfree soldering compound contains 58 wt.-% to 62 wt.-% indium, 35 wt.-% to 38 wt.-% tin, 1 wt.-% to 3.5 wt.-% silver, and 1.2 wt.-% to 1.7 wt.-% copper.

2. The pane according to claim 1, wherein the leadfree soldering compound contains 59 wt.-% to 61 wt.-% indium, and 35 wt.-% to 38 wt.-% tin.

3. The pane according to claim 1, wherein the leadfree soldering compound contains 1.5 wt.-% to 3 wt.-% silver.

4. The pane according to claim 1, wherein the leadfree soldering compound contains up to 1 wt.-% nickel.

5. The pane according to claim 1, wherein the substrate contains glass or polymers, and/or mixtures thereof.

6. The pane according to claim 1, wherein the connection element contains copper, zinc, titanium, iron, nickel, cobalt, molybdenum, tin, manganese, and/or chromium and/or alloys thereof.

7. The pane according to claim 6, wherein the connection element contains steel.

8. The pane according to claim 1, wherein the electrically conductive structure contains silver.

9. The pane according to claim 1, wherein the connection element is connected over its entire area to a subregion of the electrically conductive structure via a contact surface.

10. The pane according to claim 1, wherein the layer thickness of the leadfree soldering compound is less than or equal to 600 μ

m.

11. A method for producing the pane according to claim 1, comprising:

applying the leadfree soldering compound to the bottom of the connection element,

applying an electrically conductive structure to a substrate,

arranging the connection element with the soldering compound on the electrically conductive structure, and

soldering the connection element to the electrically conductive structure.

12. A method comprising:

using the pane according to claim 1 as a pane for motor vehicles, aircraft, ships, architectural glazing, and structural glazing.

13. The pane according to claim 1, wherein the leadfree soldering compound contains 1.4 wt.-% to 1.6 wt.-% copper.

14. The pane according to claim 4, wherein the leadfree soldering compound contains up to 0.1 wt.-% to 0.2 wt.-% nickel.

15. The pane according to claim 5, wherein the glass is flat glass, float glass, quartz glass, borosilicate glass or soda lime glass.

16. The pane according to claim 5, wherein the polymer is polyethylene, polypropylene, polycarbonate or polymethyl methacrylate.

17. The pane according to claim 7, wherein the connection element contains stainless steel.

18. The method according to claim 12, further comprising:

using the pane according to claim 1 as a pane with heating conductors and/or antenna conductors.