×

Colloidal silica chemical-mechanical polishing composition

DC
  • US 9,499,721 B2
  • Filed: 06/25/2015
  • Issued: 11/22/2016
  • Est. Priority Date: 06/25/2014
  • Status: Active Grant
First Claim
Patent Images

1. A chemical mechanical polishing composition comprising:

  • a water based liquid carrier;

    colloidal silica abrasive particles dispersed in the liquid carrier;

    a chemical species incorporated in the colloidal silica abrasive particles internal to an outer surface thereof, wherein the chemical species is a nitrogen containing compound or a phosphorus containing compound;

    a pH in a range from about 3.5 to about 6;

    wherein the colloidal silica abrasive particles have a permanent positive charge of at least 15 mV; and

    wherein the chemical species is not an aminosilane or a phosphonium silane.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×