Nanochanneled device and related methods

• US 9,526,824 B2
• Filed: 05/02/2013
• Issued: 12/27/2016
• Est. Priority Date: 11/14/2008
• Status: Active Grant

• Current Assignee: The Ohio State University Research Foundation, Board of Regents of the University of Texas System (University of Texas System)
• Original Assignee: The Ohio State University Research Foundation, Board of Regents of the University of Texas System (University of Texas System)
• Inventors: Ferrari, Mauro, Liu, Xuewu, Grattoni, Alessandro, Fine, Daniel, Goodall, Randy, Hosali, Sharath, Medema, Ryan, Hudson, Lee
• Primary Examiner(s): Tran, Binh X
• Application Number:
  US13/875,871
• Publication Number:
  US 20130240483A1
• Time in Patent Office: 1,335 Days
• Field of Search: 216/2, 216/39, 216/41, 216/56
• US Class Current: 1/1
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61M 37/00 Other apparatus for introducing media into the body for reproduction or fertilisation A61B17/425; apparatus for iontophoresis or cataphoresis A61N1/30; Percutany, i.e. introducing medicines into the body by diffusion through the skin salt baths A61H33/04
• CPC Class Codes: A61M 5/00 Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular way; Accessories therefor, e.g. filling or cleaning devices, arm-rests vaccination appliances for veterinary use A61D1/025 ; tube connectors, tube couplings, valves or branch units specially adapted for medical use A61M39/00; containers specially adapted for medical or pharmaceutical purposes A61J1/00; combinations of vial and syringe for mixing or transferring their contents A61J1/20; holders for containers for collecting, storing or administering blood or medical fluids A61J1/16
• CPC Class Codes: A61M 5/14276 specially adapted for implantation
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 2203/0338 Channels
• CPC Class Codes: B81C 1/00119 Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: B82Y 5/00 Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery
• CPC Class Codes: Y10T 137/8593 Systems
• CPC Class Codes: Y10T 156/1064 Partial cutting [e.g., grooving or incising]

Abstract

A nanochannel delivery device and method of manufacturing and use. The nanochannel delivery device comprises an inlet, an outlet, and a nanochannel. The nanochannel may be oriented parallel to the primary plane of the nanochannel delivery device. The inlet and outlet may be in direct fluid communication with the nanochannel.

Claims

1. A method of fabricating a nanochannel delivery device, the method comprising:

providing first substrate;

forming a plurality of nanochannels on the first substrate;

filling in the plurality of nanochannels with a first sacrificial material;

forming a plurality of inlet microchannels in the first substrate;

filling in the plurality of inlet microchannels with a second sacrificial material;

forming a capping layer that covers the plurality of nanochannels;

forming a plurality of outlet microchannels in the capping layer;

removing the first sacrificial material from the plurality of nanochannels; and

removing the second sacrificial material from the plurality of inlet microchannels.

2. The method of claim 1, wherein an inlet microchannel of the plurality of inlet microchannels is arranged perpendicular to a primary plane of the first substrate.

3. The method of claim 1, wherein an outlet microchannel of the plurality of outlet microchannels is arranged perpendicular to a primary plane of the first substrate.

4. The method of claim 1, wherein an inlet microchannel of the plurality of inlet microchannels is in direct fluid communication with a nanochannel.

5. The method of claim 1, wherein an outlet microchannel of the plurality of outlet microchannels is in direct fluid communication with a nanochannel.

6. The method of claim 1, wherein the inlet and outlet microchannels are patterned using a photolithography process.

7. The method of claim 1, wherein each nanochannel is between approximately one and ten nanometers deep.

8. The method of claim 1, wherein each nanochannel is between approximately ten and twenty nanometers deep.

9. The method of claim 1, wherein the first sacrificial material is subsequently removed by selective etching.

10. The method of claim 1, wherein the first sacrificial material is tungsten.

11. The method of claim 1, wherein the second sacrificial material is filled into the plurality of inlet microchannels so that the second sacrificial material extends above the top of the plurality of inlet microchannels and is planarized by chemical-mechanical planarization (CMP).

12. The method of claim 1 wherein the capping layer is selected from silicon nitride, silicon oxide, silicon carbonitride, silicon carbide, and silicon.

13. The method of claim 1, wherein the capping layer comprises multiple depositions of materials comprising tensile and compressive stresses such that the net capping layer stress is tensile.

14. The method of claim 1, wherein the capping layer is between approximately 0.5 and 1.0 microns thick.

15. The method of claim 1, wherein the capping layer is between approximately 1.0 and 2.0 microns thick.

16. The method of claim 1, wherein the capping layer is between approximately 2.0 and 4.0 microns thick.

17. The method of claim 1, wherein the second sacrificial material is subsequently removed by selective etching.

18. The method of claim 17, wherein the second sacrificial material is selected from the group consisting of:

tungsten, copper, doped glass, and undoped glass.

19. The method of claim 1, wherein the first substrate comprises a silicon-on-insulator wafer comprising an internal oxide layer.

20. The method of claim 19, wherein forming the plurality of inlet microchannels comprises etching material from the first substrate, and wherein the etching is terminated at the internal oxide layer.

21. The method of claim 20, wherein forming a plurality of inlet macrochannels comprises etching material from a back side of the first substrate, and wherein the etching is terminated at the internal oxide layer.

22. The method of claim 21, further comprising removing of the internal oxide layer after etching material to form the inlet microchannel and inlet macrochannels to open a pathway between the inlet microchannels and inlet macrochannels.