Substrate for organic electronic device

• US 9,537,097 B2
• Filed: 09/25/2013
• Issued: 01/03/2017
• Est. Priority Date: 03/29/2011
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Lee, Yeon Keun, Moon, Kyoung Sik, Jang, Seong Soo, Ahn, Yong Sik, Kim, Jung Doo, Park, Min Choon, Kim, Jung Bum
• Primary Examiner(s): Seven, Evren
• Assistant Examiner(s): Sabur, Alia
• Application Number:
  US14/036,858
• Publication Number:
  US 20140051207A1
• Time in Patent Office: 1,196 Days
• US Class Current: 1/1
• CPC Class Codes: H10K 30/00 Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation integrated devices or assemblies of multiple devices H10K39/00, H10K65/00; electrolytic light-sensitive devices H01G9/20
• CPC Class Codes: H10K 30/83 comprising arrangements for extracting the current from the cell, e.g. metal finger grid systems to reduce the serial resistance of transparent electrodes
• CPC Class Codes: H10K 50/00 Organic light-emitting devices integrated devices or assemblies of multiple devices H10K59/00, H10K65/00; organic semiconductor lasers H01S5/36
• CPC Class Codes: H10K 50/814 combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
• CPC Class Codes: H10K 50/824 combined with auxiliary electrodes
• CPC Class Codes: H10K 50/85 Arrangements for extracting light from the devices
• CPC Class Codes: H10K 50/854 comprising scattering means
• CPC Class Codes: H10K 71/621 Providing a shape to conductive layers, e.g. patterning or selective deposition
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 77/10 Substrates, e.g. flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention relates to a substrate for an organic electrode device, a manufacturing method thereof, and an organic electronic device. An exemplary substrate of the invention, if an organic light emitting element is formed on an upper part of the substrate, can obtain luminance with high emission and uniformity by efficiently controlling the surface resistance of an electrode even when the device is configured into larger sizes.

Claims

1. A method of manufacturing a substrate for an OED, comprising:

forming a conductive pattern directly on a release surface of a releasable substrate;

forming a precursor material layer for an adhesive layer directly on the conductive pattern and a surface of the releasable substrate having the conductive pattern, the precursor material layer comprising a high refractive coating solution comprising an organic or inorganic binder and scattering particles;

laminating a second substrate directly on the precursor material layer; and

converting the precursor material layer into an adhesive layer,

wherein the conductive pattern is formed to be exposed to a surface of the adhesive layer opposite to a surface of the adhesive layer attached to the second substrate, and the surface of the adhesive layer, which includes the exposed conductive pattern, is a planarized surface having a maximum height roughness of 1 μ

m or less, and

wherein the conductive pattern is formed to have a ratio of an area of the conductive pattern exposed to the planarized surface to be 0.1% to 40% of a total area of the planarized surface, for the substrate for an OED to have a sheet resistance of the planarized surface of 5 Ω

/□

or less.

2. The method of manufacturing a substrate for an OED of claim 1, wherein forming the precursor material layer and converting the precursor material layer into an adhesive layer comprises:

applying the high refractive coating solution on the conductive pattern and the surface of the releasable substrate having the conductive pattern;

drying the applied high refractive coating solution; and

curing the dried high refractive coating solution.

3. The method of manufacturing a substrate for an OED of claim 1, further comprising removing the releasable substrate.

4. The method of manufacturing a substrate for an OED of claim 1, wherein:

the forming the conductive pattern directly on the release surface of the releasable substrate is performed before the forming the precursor material layer for the adhesive layer directly on the conductive pattern and the surface of the releasable substrate having the conductive pattern;

the forming the precursor material layer for the adhesive layer directly on the conductive pattern and the surface of the releasable substrate having the conductive pattern is performed before the laminating the second substrate on the precursor material layer; and

the laminating the second substrate on the precursor material layer is performed before the converting the precursor material layer into the adhesive layer.

5. The method of manufacturing a substrate for an OED of claim 4, further comprising:

removing the releasable substrate; and

wherein the converting the precursor material layer into the adhesive layer is performed before the removing the releasable substrate.

6. The method of manufacturing a substrate for an OED of claim 5, wherein the forming the precursor material layer for the adhesive layer on the conductive pattern and the surface of the releasable substrate having the conductive pattern comprises coating the high refractive coating solution on the conductive pattern and the precursor material layer for the adhesive layer on the conductive pattern.

7. The method of manufacturing a substrate for an OED of claim 6, wherein the coating comprises bar coating, spin coating, or gravure coating.

8. The method of manufacturing a substrate for an OED of claim 1, wherein the forming the precursor material layer for the adhesive layer on the conductive pattern and the surface of the releasable substrate having the conductive pattern comprises coating the high refractive coating solution on the conductive pattern and the precursor material layer for the adhesive layer on the conductive pattern.

9. The method of manufacturing a substrate for an OED of claim 8, wherein the coating comprises bar coating, spin coating, or gravure coating.