Methods of forming three-dimensional structures having reduced stress and/or curvature

• US 9,540,233 B2
• Filed: 02/28/2014
• Issued: 01/10/2017
• Est. Priority Date: 05/07/2002
• Status: Expired due to Term

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Albarran, Jorge S., Kumar, Ananda H., Cohen, Adam L., Kim, Kieun, Lockard, Michael S., Frodis, Uri, Smalley, Dennis R.
• Primary Examiner(s): ZHAO, XIAO SI
• Application Number:
  US14/194,564
• Publication Number:
  US 20140238865A1
• Time in Patent Office: 1,047 Days
• Field of Search: 205/135
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00666 Treatments for controlling internal stress or strain in MEMS structures
• CPC Class Codes: C25D 5/022 using masking means

Claims