Alkali silicate glass based coating and method for applying

• US 9,565,758 B2
• Filed: 12/24/2013
• Issued: 02/07/2017
• Est. Priority Date: 08/23/2006
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Lower, Nathan P., Boone, Alan P., Wilcoxon, Ross K., Hillman, David D.
• Primary Examiner(s): Fletcher, III, William Phillip
• Application Number:
  US14/140,192
• Publication Number:
  US 20140102776A1
• Time in Patent Office: 1,141 Days
• Field of Search: 174/258, 427/58, 427/96.1, 427/96.2
• US Class Current: 1/1
• CPC Class Codes: B29D 23/00 Producing tubular articles B29D24/00 takes precedence
• CPC Class Codes: C09D 1/02 alkali metal silicates
• CPC Class Codes: C09D 5/32 Radiation-absorbing paints protection against X-, gamma- or corpuscular radiation G21F
• CPC Class Codes: C23D 5/00 Coating with enamels or vitreous layers
• CPC Class Codes: C23D 5/005 by a method specially adapted for coating special objects
• CPC Class Codes: H01F 1/083 in a bonding agent
• CPC Class Codes: H01F 1/113 in a bonding agent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29311 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/2939 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/294 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01037 : Rubidium [Rb]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/01105 : Rare earth metals
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 31/048 : Encapsulation of modules
• CPC Class Codes: H01L 31/055 : where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
• CPC Class Codes: H02S 40/20 : Optical components
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: Y02E 10/52 : PV systems with concentrators

Abstract

A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

Claims

1. A method for preventing the oxidation of a solder joint or electrical interconnect of an electronic device, comprising:

applying an alkali silicate glass material solution to the soldering joint or electrical interconnect; and

curing the alkali silicate glass material solution at a temperature less than or equal to approximately 160°

C. to form an alkali silicate glass based coating on the soldering joint or electrical interconnect.

2. The method of claim 1, wherein the alkali silicate glass based coating is applied to the soldering joint, the soldering joint being a lead free soldering joint.

3. The method of claim 2, wherein the lead free soldering joint comprises a surface finish.

4. The method of claim 3 wherein the lead free soldering joint comprises a whisker and the coating covers the whisker.

5. The method of claim 4, wherein the surface finish comprises tin, cadmium, or zinc.

6. The method of claim 1, wherein the soldering joint is one of a plurality of a solder bumps provided upon a bottom surface of a circuit board and the alkali silicate glass coating provides a planar layer covering the solder bumps.

7. The method of claim 1, wherein the alkali silicate glass based coating comprises at least one material selected from the group consisting of lithium silicate, sodium silicate, and potassium silicate.

8. The method of claim 7, wherein the alkali silicate glass based coating comprises lithium silicate and potassium silicate.

9. The method of claim 1, wherein the alkali silicate glass based coating comprises thermally conductive particles provided therein.