Implantable device for the brain
First Claim
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1. A neural stimulator comprising:
- a hermetic package enclosing electronics suitable to be implanted within a head;
a flange defining a plurality of voids around the hermetic package suitable to accept screws adapted for mounting the hermetic package to the cranium; and
a flexible thin film electrode array electrically coupled to said electronics suitable for direct contact with and direct stimulation of the brain includinga flexible polymer base layer;
patterned metal traces deposited on said flexible polymer base layer the metal traces forming a bond pad portion connected to the hermetic electronics package, an electrode portion adapted for contact with the brain and a cable portion connecting the bond pad portion to the electrode portion; and
a flexible polymer top layer deposited on said flexible polymer base layer and said metal traces and defining voids exposing said electrodes, the thin film electrode array forming both non-penetrating approximately flat surface electrodes suitable to stimulate the surface of the brain and forming electrodes on penetrating spikes suitable to stimulate the brain at some depth.
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Abstract
The present invention consists of an implantable device with at least one package that houses electronics that receives input data or signals, and optionally power, from an external system through at least one coil attached to the at least one package, processes the input data and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
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Citations
12 Claims
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1. A neural stimulator comprising:
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a hermetic package enclosing electronics suitable to be implanted within a head; a flange defining a plurality of voids around the hermetic package suitable to accept screws adapted for mounting the hermetic package to the cranium; and a flexible thin film electrode array electrically coupled to said electronics suitable for direct contact with and direct stimulation of the brain including a flexible polymer base layer; patterned metal traces deposited on said flexible polymer base layer the metal traces forming a bond pad portion connected to the hermetic electronics package, an electrode portion adapted for contact with the brain and a cable portion connecting the bond pad portion to the electrode portion; and a flexible polymer top layer deposited on said flexible polymer base layer and said metal traces and defining voids exposing said electrodes, the thin film electrode array forming both non-penetrating approximately flat surface electrodes suitable to stimulate the surface of the brain and forming electrodes on penetrating spikes suitable to stimulate the brain at some depth. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification