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Signal trace patterns for flexible substrates

  • US 9,600,112 B2
  • Filed: 10/10/2014
  • Issued: 03/21/2017
  • Est. Priority Date: 10/10/2014
  • Status: Active Grant
First Claim
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1. Apparatus, comprising:

  • a flexible substrate layer having a bend;

    conductive traces on the flexible substrate layer that overlap the bend, wherein each conductive trace is formed from a chain of interconnected segments, each segment enclosing an opening having first and second opposing ends, wherein each conductive trace has a first portion formed in a first layer of metal and a second portion formed in a second layer of metal, wherein the first portion and the second portion have meandering shapes that intersect at the first and second opposing ends of each opening; and

    a plurality of metal vias that interconnect the first portion and the second portion, wherein the plurality of metal vias includes first and second metal vias that couple the first portion and the second portion at the first and second opposing ends of each opening.

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