Controlled fluid delivery in a microelectronic package

• US 9,604,210 B2
• Filed: 04/10/2015
• Issued: 03/28/2017
• Est. Priority Date: 12/28/2007
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Supriya, Lakshmi, Matayabas, James C. Jr., Chakrapani, Nirupama
• Primary Examiner(s): Wecker, Jennifer
• Application Number:
  US14/683,826
• Publication Number:
  US 20150209780A1
• Time in Patent Office: 718 Days
• US Class Current: 1/1
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/00619 using hydrophilic or hydrophobic regions
• CPC Class Codes: B01L 2200/025 Align devices or objects to ensure defined positions relative to each other
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2200/0605 Metering of fluids
• CPC Class Codes: B01L 2200/10 Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
• CPC Class Codes: B01L 2300/046 Function or devices integrated in the closure
• CPC Class Codes: B01L 2300/0627 Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0819 Microarrays; Biochips
• CPC Class Codes: B01L 2300/0822 Slides
• CPC Class Codes: B01L 2300/0867 Multiple inlets and one sample wells, e.g. mixing, dilution
• CPC Class Codes: B01L 2300/089 Virtual walls for guiding liquids
• CPC Class Codes: B01L 2300/16 Surface properties and coatings
• CPC Class Codes: B01L 2300/161 Control and use of surface tension forces, e.g. hydrophobic, hydrophilic
• CPC Class Codes: B01L 2300/165 Specific details about hydrophobic, oleophobic surfaces
• CPC Class Codes: B01L 2400/0406 capillary forces
• CPC Class Codes: B01L 2400/0688 surface tension valves, capillary stop, capillary break
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 : characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
• CPC Class Codes: B05D 3/12 : by mechanical means
• CPC Class Codes: B05D 5/00 : Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures

Abstract

A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Claims

1. A method for forming virtual fluidic channels on a substrate to channel a fluid to a die, comprising:

providing a die on a substrate, the die including one or more fluidic circuits;

patterning a coating on the substrate to define a fluid path from an edge of the substrate to the die;

patterning a coating on a cover corresponding to the fluid flow path;

positioning a spacer on the substrate; and

placing the cover over the substrate and the spacer, wherein the coatings define a virtual fluidic path to channel a fluid to the die.

2. The method of claim 1, wherein the patterning comprises stamping the substrate and the cover with a stamp having the coating thereon.

3. The method of claim 1, wherein the coating comprises a wetting coating within the fluid flow path.

4. The method of claim 3, wherein the wetting coating comprises nanoparticles including silica or titania.

5. The method of claim 1, comprising providing a dewetting coating surrounding the fluid flow path.

6. The method of claim 5, wherein the dewetting coating comprises one of alkoxysilanes and alkanethiolates.

7. A system, comprising:

a substrate having a die positioned thereon including CMOS and MEMS circuits for processing biological fluids;

a cover over the substrate; and

a virtual fluid path comprising one of a wetting or dewetting coating patterned on the substrate and the cover for channeling the biological fluids from an inlet on an edge of the substrate to the die.

8. The system of claim 7, wherein the wetting coating comprises nanoparticles including silica or titania within the fluid path.

9. The system of claim 7, wherein the dewetting comprises one of alkoxysilanes and alkanethiolates surrounding the fluid path.

10. A system, comprising:

a substrate having a hollow defining space;

a die positioned in the hollow defining space so that a top surface thereof is flush with a top surface of the substrate, and which includes CMOS and MEMS circuits and a fluidic channel for processing biological fluids;

a cover over the substrate; and

a fluid path including a first coating patterned on the substrate and a second coating patterned on the cover, wherein the first coating and the second coating respectively comprise a wetting coating within the fluid flow path, and the wetting coating comprises functionalized nanoparticles including any of silica in epoxy resin or titania; and

a plurality of fluid inlet ports provided on an edge of the substrate and in line with the fluid flow path,

wherein the fluid flow path is to channel the biological fluids from the fluid inlet ports to the die.

11. The system of claim 10, further comprising a spacer between the substrate and the cover.