Heat sink base and shield

• US 9,606,590 B2
• Filed: 12/22/2011
• Issued: 03/28/2017
• Est. Priority Date: 12/22/2011
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Walker, Paul N., Moore, Earl W
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Gafur, Razmeen
• Application Number:
  US14/357,360
• Publication Number:
  US 20140307385A1
• Time in Patent Office: 1,923 Days
• Field of Search: 361676-678, 36167946-67954, 361688-723, 165 801- 805, 165/104.33, 165/185, 174 151- 153, 174 161- 163, 174/547, 174/548, 257712-722, 257/E23.088, 244/53, 24458-459, 454/184, 312/236
• US Class Current: 1/1
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

A heat sink of a computing system includes a base and a shield associated with a component. The base is to mount to the computing system, and the shield is to be coupled to the base.

Claims

1. A heat sink comprising:

a metal base to be mounted to a circuit board of a computing system and to receive a component, wherein the metal base is to thermally contact a first face of the component; and

a metal shield pivotally attached to the metal base, the metal shield to thermally contact a second face of the component, the second face opposite of the first face on the component, wherein the metal shield is pivotable between an open position with respect to the metal base and a closed position with respect to the metal base,

wherein when the metal shield is pivoted to the open position, the component is insertable into a space between the metal base and the metal shield, and

wherein the metal shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the metal shield and the metal base.

2. The heat sink of claim 1, wherein the metal base and the metal shield are formed of heat conductive materials to spread heat generated by the component.

3. The heat sink of claim 1, wherein at least one of the metal base and the metal shield is contoured based on the component.

4. The heat sink of claim 1, further comprising a thermal interface material on the metal base, the metal base to thermally contact the first face of the component through the thermal interface material.

5. The heat sink of claim 1, wherein the component is a memory module, and the metal base includes a fastener to releasably mount the memory module to the metal base.

6. A heat sink comprising:

a base to be mounted to a computing system and to receive a component, wherein the base is to thermally couple a first face of the component; and

a shield to thermally couple a second face of the component, wherein the shield is pivotably attached to the base, the shield pivotable between an open position with respect to the base and a closed position with respect to the base,

wherein when the shield is pivoted to the open position, the component is insertable into a space between the base and the shield, and

wherein the shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the shield and the base.

7. The heat sink of claim 6, wherein when the shield is pivoted to the open position, the component is insertable at an angle into the space between the base and the shield.

8. The heat sink of claim 6, wherein the base is a metal base.

9. The heat sink of claim 6, wherein the base has an air gap to provide a space for airflow between the base and a circuit board to which the base is to be mounted.

10. The heat sink of claim 6, wherein the shield has an opening to allow airflow through the shield.

11. A computing system comprising:

a printed circuit board (PCB);

a component;

a base securing the component to the PCB, wherein the base is to transfer heat from a first face of the component; and

a shield pivotably attached to the base, wherein the shield is to transfer heat from a second face of the component, wherein the shield is pivotable between an open position with respect to the base and a closed position with respect to the base,

wherein the component is insertable into a space between the base and the shield when the shield is pivoted to the open position, and

wherein the shield is pivotable from the open position to the closed position after insertion of the component to sandwich the component between the shield and the base.

12. The computing system of claim 11, further comprising a body surface in close proximity to the component, wherein the shield is to prevent a hot spot on the body surface due to heat from the component.

13. The computing system of claim 11, wherein the base includes a slot to admit an electrical interface of the component to interface with the computing system.

14. The computing system of claim 11, further comprising an air passage between the base and the PCB.

15. The computing system of claim 11, wherein the base is thermally contacted to the first face of the component, and the shield is thermally contacted to the second face of the component, the second face being opposite of the first face on the component.

16. The computing system of claim 11, wherein the base is a metal base, and the shield is a metal shield.

17. The computing system of claim 11, wherein the shield has an opening to allow airflow through the shield.