Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
First Claim
1. A method of making an area array integrated circuit (IC) package for an IC device, the method comprising the steps of:
- electrically coupling a first surface of the IC device to conductive traces on a first surface of a first substrate;
mechanically coupling a first surface of an interconnect assembly to the first surface of the first substrate;
locating contact members in openings formed in a second surface of the interconnect assembly, the contact members including elongated beams extending in the openings generally perpendicular to the second surface of the interconnect assembly;
electrically coupling the contact members located in the openings in the interconnect assembly to the conductive traces on the first surface of the first substrate;
positioning a second substrate opposite the IC device and the first surface of the first substrate, the interconnect assembly maintaining a separation between the first and second substrates that creates a recess and maintaining a separation between a second opposite surface of the IC device and the second substrate, the separation between the first and second substrates being greater than a separation between the first and second surfaces of the IC device, so the IC device is located in the recess and interposed between the first and second substrates;
inserting solder balls attached to, and electrically coupled with, conductive traces on a second substrate into the openings located along a second surface of the interconnect assembly so that the first substrate, the interconnect assembly, and the second substrate substantially surround the IC device; and
electrically coupling the solder balls on the second substrate to the contact members located in the openings in the interconnect assembly, comprising deflecting contact beams on the contact members outward to mechanically compressively couple with the solder balls.
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Accused Products
Abstract
An area array integrated circuit (IC) package for an IC device. The IC package includes a first substrate with conductive traces electrically coupled to the IC device. An interconnect assembly having a first surface is mechanically coupled to the first substrate. The interconnect assembly includes a plurality of contact members electrically coupled to the conductive traces on the first substrate. A second substrate is mechanically coupled to a second surface of the interconnect assembly so that the first substrate, the interconnect assembly, and the second substrate substantially surround the IC device. The second substrate includes conductive traces that are electrically coupled to the contact members in the interconnect assembly.
410 Citations
8 Claims
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1. A method of making an area array integrated circuit (IC) package for an IC device, the method comprising the steps of:
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electrically coupling a first surface of the IC device to conductive traces on a first surface of a first substrate; mechanically coupling a first surface of an interconnect assembly to the first surface of the first substrate; locating contact members in openings formed in a second surface of the interconnect assembly, the contact members including elongated beams extending in the openings generally perpendicular to the second surface of the interconnect assembly; electrically coupling the contact members located in the openings in the interconnect assembly to the conductive traces on the first surface of the first substrate; positioning a second substrate opposite the IC device and the first surface of the first substrate, the interconnect assembly maintaining a separation between the first and second substrates that creates a recess and maintaining a separation between a second opposite surface of the IC device and the second substrate, the separation between the first and second substrates being greater than a separation between the first and second surfaces of the IC device, so the IC device is located in the recess and interposed between the first and second substrates; inserting solder balls attached to, and electrically coupled with, conductive traces on a second substrate into the openings located along a second surface of the interconnect assembly so that the first substrate, the interconnect assembly, and the second substrate substantially surround the IC device; and electrically coupling the solder balls on the second substrate to the contact members located in the openings in the interconnect assembly, comprising deflecting contact beams on the contact members outward to mechanically compressively couple with the solder balls. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification