Internal plasma grid applications for semiconductor fabrication

• US 9,633,846 B2
• Filed: 11/30/2015
• Issued: 04/25/2017
• Est. Priority Date: 04/05/2013
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Paterson, Alex, Kim, Do Young, Kamarthy, Gowri, Del Puppo, Helene, Yu, Jen-Kan, Titus, Monica, Mani, Radhika, Sun, Noel Yui, Gani, Nicolas, Kimura, Yoshie, Chung, Ting-Ying
• Primary Examiner(s): Rizkallah, Kimberly
• Assistant Examiner(s): Belousov, Alexander
• Application Number:
  US14/954,586
• Publication Number:
  US 20160086795A1
• Time in Patent Office: 512 Days
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01L 21/0273 characterised by the treatment of photoresist layers
• CPC Class Codes: H01L 21/28123 Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/31138 by dry-etching
• CPC Class Codes: H01L 21/32137 of silicon-containing layers
• CPC Class Codes: H01L 21/76224 using trench refilling with dielectric materials trench filling with polycristalline silicon H01L21/763; together with vertical isolation, e.g. trench refilling in a SOI substrate H01L21/76264
• CPC Class Codes: H01L 29/66795 with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET

Abstract

The embodiments disclosed herein pertain to improved methods and apparatus for etching a semiconductor substrate. A plasma grid assembly is positioned in a reaction chamber to divide the chamber into upper and lower sub-chambers. The plasma grid assembly may include one or more plasma grids having slots of a particular aspect ratio, which allow certain species to pass through from the upper sub-chamber to the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. Electrons that make it through the grid to the lower sub-chamber are cooled as they pass through. In some cases, this results in an ion-ion plasma in the lower sub-chamber. The ion-ion plasma may be used to advantage in a variety of etching processes.

Claims

1. A method of reflowing photoresist, the method comprising:

receiving a substrate in a reaction chamber, the substrate having photoresist patterned thereon, wherein the reaction chamber comprises a grid structure dividing the interior of the reaction chamber into an upper sub-chamber proximate a plasma generator and a lower sub-chamber proximate a substrate holder;

flowing a first plasma generating gas into the upper sub-chamber;

generating a first plasma in the upper sub-chamber from the first plasma generating gas, the first plasma having a first electron density, and generating a second plasma in the lower sub-chamber, wherein the second plasma is an ion-ion plasma that has a second electron density at least about 10 times lower than the first electron density;

exposing the substrate to the second plasma to smooth the photoresist;

flowing a second plasma generating gas into the upper sub-chamber;

generating a third plasma in the upper sub-chamber from the second plasma generating gas, the third plasma having a third electron density, and generating a fourth plasma in the lower sub-chamber, wherein the fourth plasma is an ion-ion plasma that has a fourth electron density at least about 10 times lower than the third electron density; and

exposing the substrate to the fourth plasma,

wherein before exposing the substrate to the second plasma the photoresist has an initial line width roughness, wherein after exposing the substrate to the fourth plasma the photoresist has a final line width roughness, and wherein the final line width roughness is about 75% or less of the initial line width roughness.

2. The method of claim 1,

wherein exposing the substrate to the fourth plasma removes photoresist in a foot region of the photoresist.

3. The method of claim 1, wherein the first plasma generating gas comprises at least one gas selected from the group consisting of:

H₂, Ar, HBr, and combinations thereof.

4. The method of claim 3, wherein the first plasma generating gas further comprises N₂ and/or HeSTG.

5. The method of claim 3, wherein the first plasma generating gas comprises H₂.

6. The method of claim 1, wherein the second plasma generating gas comprises at least one gas selected from the group consisting of Ar, HBr, and a combination thereof.

7. The method of claim 6, wherein the second plasma generating gas comprises Ar.

8. The method of claim 7, wherein the first plasma generating gas comprises H₂.

9. The method of claim 1, wherein exposing the substrate to the second plasma both (i) smooths the photoresist, and (ii) removes the photoresist in a foot region of the photoresist.

10. The method of claim 9, wherein the first plasma generating gas comprises H₂, N₂, and HeSTG.

11. The method of claim 1, wherein the photoresist comprises extreme ultraviolet photoresist.

12. The method of claim 1, further comprising applying a bias voltage to the substrate while the substrate is exposed to the fourth plasma, wherein the bias voltage is about 200V or less.

13. The method of claim 12, wherein the bias voltage is greater than about 30V.

14. The method of claim 1, wherein before exposing the substrate to the second plasma the photoresist has an initial height, wherein after exposing the substrate to the fourth plasma the photoresist has a final height, and wherein the final height is at least about 50% of the initial height.

15. The method of claim 1, wherein the final line width roughness is about 65% or less of the initial line width roughness.

16. The method of claim 1, wherein the first plasma has a first electron temperature of about 2 eV or more, and wherein the second plasma has a second effective electron temperature of about 1 eV or less.

17. The method of claim 1, wherein the second electron density is about 5×

10⁹ cm<sup>−

3</sup> or less.

18. The method of claim 1, wherein a ratio of negative ions:

positive ions in the second plasma is between about 0.5-1.

19. The method of claim 1, wherein the first plasma is an inductively coupled plasma generated at a power between about 300-1000 Watts per substrate.

20. The method of claim 19, wherein a bias applied to the substrate is between about 50-200 V.

21. The method of claim 1, wherein after smoothing the photoresist, the substrate has a line width roughness of about 3.0 nm or below.

22. The method of claim 1,

wherein the first plasma generating gas and the second plasma generating gas have different compositions.

23. The method of claim 22, wherein the first plasma generating gas comprises H₂, and wherein the second plasma generating gas does not comprise H₂.