Contact for semiconductor fabrication
DCFirst Claim
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1. A semiconductor device comprising:
- a substrate;
a fin structure on the substrate, the fin structure comprising a doped region;
a first gate over the fin structure, the first gate positioned adjacent the doped region, the first gate having a spacer on a first side and having no spacer on a second side between the gate and the doped region, the first gate including a gate dielectric layer disposed over the fin structure and a gate electrode disposed over the gate dielectric layer and physically contacting the gate dielectric layer, the gate dielectric layer extending along opposing sidewalls of the gate electrode towards a top of the first gate without extending to the top of the first gate on the second side of the first gate; and
a conductive plug that physically contacts the doped region, the gate dielectric layer, one of the sidewalls of the gate electrode and the top of the first gate.
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Abstract
A semiconductor device includes a substrate, a fin structure on the substrate, the fin structure comprising a doped region, a first gate over the fin structure, the first gate positioned adjacent the doped region, the first gate having a spacer on a first side and having no spacer on a second side between the gate and the doped region, and a conductive plug that contacts the doped region and a top of the gate.
11 Citations
20 Claims
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1. A semiconductor device comprising:
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a substrate; a fin structure on the substrate, the fin structure comprising a doped region; a first gate over the fin structure, the first gate positioned adjacent the doped region, the first gate having a spacer on a first side and having no spacer on a second side between the gate and the doped region, the first gate including a gate dielectric layer disposed over the fin structure and a gate electrode disposed over the gate dielectric layer and physically contacting the gate dielectric layer, the gate dielectric layer extending along opposing sidewalls of the gate electrode towards a top of the first gate without extending to the top of the first gate on the second side of the first gate; and a conductive plug that physically contacts the doped region, the gate dielectric layer, one of the sidewalls of the gate electrode and the top of the first gate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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a substrate; a fin structure formed on the substrate, the fin structure comprising a doped region; a first gate on a first side of the doped region, the first gate including a gate dielectric layer disposed over the fin structure and a gate electrode disposed over the gate dielectric layer and physically contacting the gate dielectric layer, the gate dielectric layer extending along opposing sidewalls of the gate electrode towards a top of the first gate; a second gate on a second side of the doped region, the second side being opposite the first side, the second gate having spacers on both sides; a self-aligned contact between the first gate and the second gate, the self-aligned contact physically contacting the gate dielectric layer and one of the sidewalls of the gate electrode; and a butt contact that is in direct connection with the top of the first gate and the self-aligned contact. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method for forming a semiconductor device, the method comprising:
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providing a substrate; forming a fin structure on the substrate; forming a dummy gate over the fin structure; forming sidewall spacers on both sides of the dummy gate; forming a doped region within the fin structure, the doped region being formed adjacent the dummy gate; replacing the dummy gate with a gate, the gate including a gate dielectric layer and metal gate electrode disposed over the gate dielectric layer and physically contacting the gate dielectric layer, the gate dielectric layer extending along opposing sidewalls of the metal gate electrode towards a top of the gate; removing a spacer from a first side of the gate to expose the gate dielectric layer, the first side being between the gate and the doped region; removing a portion of the gate dielectric layer to expose one of the sidewalls of the metal gate electrode; and forming a conductive plug that physically contacts the doped region, the gate dielectric layer, the one of the sidewalls of the metal gate electrode, and a top of the gate. - View Dependent Claims (19, 20)
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Specification