Thin film battery on an integrated circuit or circuit board and method thereof
First Claim
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1. An integrated circuit including a battery, comprising:
- a semiconductor device having a surface;
a bonding layer coupled with the surface of the semiconductor device, the bonding layer comprising a first embedded conductor and a second embedded conductor;
a battery cell structure in selective electrical contact with the surface of the semiconductor device via the first embedded conductor; and
a first electrical contact having a lower surface to which the battery cell structure is directly attached, wherein the bonding layer and the battery cell structure are sandwiched between the surface of the semiconductor device and the lower surface of the first electrical contact, wherein the surface of the semiconductor device is in selective electrical contact with the first electrical contact via the second embedded conductor being in direct contact with the lower surface of the first electrical contact to which the battery cell structure is directly attached.
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Abstract
The present invention relates to flexible thin film batteries on semiconducting surface or the conductive or insulating packaging surface of a semiconductor device and methods of constructing such batteries. Electrochemical devices may be glued to a semiconducting surface or the conductive or insulating packaging surface of a semiconductor device or deposited directly thereon. The invention also relates to flexible thin film batteries on flexible printed circuit board where the electrochemical devices may also be glued or deposited on the flexible printed circuit board.
814 Citations
13 Claims
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1. An integrated circuit including a battery, comprising:
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a semiconductor device having a surface; a bonding layer coupled with the surface of the semiconductor device, the bonding layer comprising a first embedded conductor and a second embedded conductor; a battery cell structure in selective electrical contact with the surface of the semiconductor device via the first embedded conductor; and a first electrical contact having a lower surface to which the battery cell structure is directly attached, wherein the bonding layer and the battery cell structure are sandwiched between the surface of the semiconductor device and the lower surface of the first electrical contact, wherein the surface of the semiconductor device is in selective electrical contact with the first electrical contact via the second embedded conductor being in direct contact with the lower surface of the first electrical contact to which the battery cell structure is directly attached. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a battery on a first electrical contact comprising:
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creating a selectively conductive bonding layer, the bonding layer comprising a first embedded conductor and a second embedded conductor; coupling the bonding layer with an upper horizontal surface of a semiconductor device, wherein both the first embedded conductor and the second embedded conductor directly contact the upper horizontal surface of the semiconductor device; directly attaching a first side of a battery cell structure to a lower surface of the first electrical contact; and coupling a second side of the battery cell structure with the bonding layer, wherein the second side of the battery cell structure is in direct contact with the first embedded conductor; and
wherein the upper horizontal surface of the semiconductor device is in selective electrical contact with the first electrical contact via the second embedded conductor being in direct contact with the lower surface of the first electrical contact to which the first side of the battery cell structure is directly attached. - View Dependent Claims (12, 13)
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Specification