RFID transponder chip modules

• US 9,634,391 B2
• Filed: 02/11/2015
• Issued: 04/25/2017
• Est. Priority Date: 08/08/2011
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa, Molloy, Darren
• Primary Examiner(s): LY, TOAN C
• Application Number:
  US14/619,170
• Publication Number:
  US 20150269472A1
• Time in Patent Office: 804 Days
• Field of Search: 235492
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out

Abstract

The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

Claims

1. A transponder chip module (TCM) comprising:

a first module tape (MT1) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof; and

a second module tape (MT2) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof;

wherein the second module tape (MT2) is joined to the first module tape (MT1);

wherein the top of the first module tape (MT1) is joined to the bottom of the second module tape (MT2).

2. The transponder chip module of claim 1, further comprising:

conductive elements extending through the second module tape and aligned with at least some of the contact pads.

3. The transponder chip module of claim 2, further comprising:

through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.

4. The transponder chip module of claim 1, further comprising:

through holes (TH) extending through the first module tape and aligned with outer and inner portions of the connection bridge.

5. The transponder chip module of claim 1, further comprising:

an RFID chip (IC) disposed through an opening (OP) extending through the first module tape allowing mounting of the RFID chip on the second module tape.

6. A method of making a transponder chip module (TCM) comprising:

providing a first module tape (MT1) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof;

providing a second module tape (MT2) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof; and

joining the second module tape (MT2) to the first module tape (MT1);

wherein the top of the first module tape (MT1) is joined to the bottom of the second module tape (MT2).

7. The method of claim 6, further comprising:

providing conductive elements extending through the second module tape and aligned with at least some of the contact pads.

8. The method of claim of claim 7, further comprising:

providing through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.

9. The method of claim of claim 6, further comprising:

providing through holes (TH) extending through the first module tape (MT1) and aligned with outer and inner portions of the connection bridge.

10. The method of claim 6, further comprising:

providing an opening (OP) extending through the first module tape allowing mounting of an RFID chip (IC) on the second module tape.