Flexible substrate, display device and method for bonding electronic devices on flexible substrate

• US 9,651,996 B2
• Filed: 07/15/2013
• Issued: 05/16/2017
• Est. Priority Date: 04/28/2013
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Zhou, Weifeng
• Primary Examiner(s): Vonch, Jeff
• Application Number:
  US14/348,481
• Publication Number:
  US 20150192961A1
• Time in Patent Office: 1,401 Days
• Field of Search: None
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 37/18 involving the assembly of discrete sheets or panels only
• CPC Class Codes: B32B 38/0012 Mechanical treatment, e.g. roughening, deforming, stretching
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: G06F 1/1637 Details related to the display arrangement, including those related to the mounting of the display in the housing
• CPC Class Codes: G06F 1/1652 the display being flexible, e.g. mimicking a sheet of paper, or rollable
• CPC Class Codes: H04M 1/0268 including a flexible display panel
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 2201/055 Folded back on itself
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1026 with slitting or removal of material at reshaping area prior to reshaping
• CPC Class Codes: Y10T 156/1043 Subsequent to assembly
• CPC Class Codes: Y10T 156/1051 by folding
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal
• CPC Class Codes: Y10T 428/24174 including sheet or component perpendicular to plane of web or sheet
• CPC Class Codes: Y10T 428/24182 Inward from edge of web or sheet
• CPC Class Codes: Y10T 428/24215 Acute or reverse fold of exterior component
• CPC Class Codes: Y10T 428/24264 Particular fold structure [e.g., beveled, etc.]
• CPC Class Codes: Y10T 428/24273 : including aperture
• CPC Class Codes: Y10T 428/24479 : including variation in thickness

Abstract

A flexible substrate, a display device and a method for bonding an electronic device onto a flexible substrate are disclosed. The flexible substrate includes a base substrate, the base substrate includes a bonding portion for bonding an electronic device and an auxiliary bonding portion integrally formed with the bonding portion, the auxiliary bonding portion and the bonding portion are disposed back to back, and the bonding portion completely falls into a region where the auxiliary bonding portion is provided in an orthographic projection direction. With an auxiliary bonding portion being disposed beside the bonding portion for bonding the electronic devices such as ICs and FPCs, when bonding the electronic device onto the bonding portion, the auxiliary bonding portion can enhance the strength of the bonding portion and improve the bonding alignment precision and contact property of the electronic device, which further improves the non-defect ratio of the flexible display device and has a lower cost.

Claims

1. A flexible substrate for bonding an electronic device comprising a base substrate, wherein the base substrate comprising a non-bonding portion integrally formed with an edge of a bonding portion for bonding the electronic device thereon and an auxiliary bonding portion integrally formed with an opposing edge of the bonding portion, the auxiliary bonding portion and the bonding portion are disposed back to back, and the bonding portion completely falls into a region where the auxiliary bonding portion is provided in an orthrographic projection direction;

wherein a first bending line is disposed between the bonding portion and the auxiliary bonding portion, the auxiliary bonding portion comprises a first sub-bonding portion, an area of the first sub-bonding portion is larger than or equal to an area of the bonding portion, the first sub-bonding portion is bent and disposed onto the back side of the of the bonding portion along the first bending line; and

wherein the auxiliary bonding portion further has a second sub-bonding portion having at least one stacked layer, a second bending line is disposed between the first sub-bonding portion and the second sub-bonding portion, and the second sub-bonding portion is bent and disposed onto the back side of the first sub-bonding portion along the second bending line, the auxiliary bonding portion is a removable auxiliary bonding portion and is removed after bonding the electronic device.

2. The flexible substrate of claim 1, wherein the auxiliary bonding portion and the bonding portion are made of the same material.

4. The flexible substrate of claim 1, wherein a third bending line is disposed between adjacent stacked layers in the second sub-bonding portion, a groove along the thickness direction of the stacked layers in the second sub-bonding portion is disposed at a position on the base substrate that corresponds to the third bending line, and a depth of the groove is less than a thickness of a stacked layer in the second sub-bonding portion;

or

a plurality of through holes or blind holes along the thickness direction of the stacked layers in the second sub-bonding portion is disposed at a position on the base substrate that corresponds to the third bending line.

6. A display device comprising the flexible substrate of claim 1.

3. The flexible substrate of claim wherein a groove(s) along the thickness direction of the bonding portion is formed at a position(s) on the base substrate that corresponds to the first bending line and/or the second bending line, a depth of the groove(s) is less than the thickness of the bonding portion;

or

a plurality of through holes or band holes along the thickness direction of the bonding portion are disposed at a position(s) on the base substrate that corresponds to the first bending line and/or the second bending lines.

5. The flexible substrate of claim 3, wherein a third bending line is disposed between adjacent stacked layers in the second sub-bonding portion, a groove along the thickness direction of the stacked layers in the second sub-bonding portion is disposed at a position on the base substrate that corresponds to the third bending line, and a depth of the groove is less than a thickness of a stacked layer in the second sub-bonding portion;

or

a plurality of through holes or blind holes along the thickness direction of the stacked layers in the second sub-bonding portion is disposed at a position on the base substrate that corresponds to the third bending line.

7. A method for bonding an electronic device onto a flexible substrate, comprising a step of bonding the electronic device onto a base substrate of the flexible substrate, wherein the base substrate comprises a non-bonding portion integrally formed with an edge of a bonding portion for bonding the electronic device thereon, wherein the method further comprises the following step before the step of bonding the electronic device onto the base substrate of the flexible substrate:

integrally forming an auxiliary bonding portion disposed back to back with the bonding portion allowing the bonding portion to completely fall into a region where the auxiliary bonding portion is provided in the orthographic projection direction, wherein forming the auxiliary bonding portion comprises;

extending a base substrate from an opposing edge of the bonding portion to dispose an extension portion with an area of the extension portion being larger than or equal to that of the bonding portion;

bending the extension portion towards a back side of the bonding portion such that the extension portion forms the auxiliary bonding portion disposed back to back with the bonding portion;

wherein a first bending line is disposed between the bonding portion and the extension portion, the extension portion has a first sub-extension portion with an area larger than or equal to an area of the bonding portion, the first sub-extension portion is bent and disposed onto the back side of the of the bonding portion along the first bending line to form a first sub-bonding portion;

wherein the extension portion further comprises a second sub-extension portion having at least one stacked layer, a second bending line is disposed between the first sub-extension portion and the second sub-extension portion, and the second sub-extension portion is bent and disposed onto the back side of the first sub-extension portion along the second bending line to form a second sub-bonding portion; and

removing the auxiliary bonding portion after bonding the electronic device onto the base substrate of the flexible substrate.

8. The method of claim 7, wherein the extension portion and the bonding portion are made of a same material.

9. The method of claim 8, further comprises forming a groove along a thickness direction of the bonding portion at a position on the base substrate that corresponds to the first bending line, and a depth of the groove is smaller than the thickness of the bonding portion;

or

forming a plurality of through holes or blind holes along a thickness direction of the bonding portion at a position on the base substrate that corresponds to the first bending line.

10. The method of claim 8, further comprises a third bending line is disposed between adjacent stacked layers in the second sub-extension portion, a groove(s) along the thickness direction of the stacked layers in the second sub-bonding portion is disposed at a position(s) of the extension portion that corresponds to the second and/or third bending lines, a depth of the groove(s) less than the thickness of the extension portion;

or

a plurality of through holes or blind holes along thickness direction of the stacked layers in the extension portion is disposed at a position of the extension portion that corresponds to the second and/or third bending lines.