Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
First Claim
1. A device comprising:
- a first light emitting diode (LED) die;
a first substrate with a top surface and a bottom surface, wherein the first LED die is disposed adjacent to the top surface of the first substrate, and wherein no electrical conductor passes from the top surface of the first substrate to the bottom surface of the first substrate;
a plurality of landing pads disposed on the top surface of the first substrate;
an interconnect structure having a conductor, a lip and a bottom surface; and
a plurality of contact pads disposed on an underside of the lip of the interconnect structure, wherein the substrate is electrically and mechanically connected to the interconnect structure only by the landing pads being attached to the contact pads, wherein the bottom surface of the interconnect structure and the bottom surface of the first substrate are substantially coplanar, and wherein the conductor of the interconnect structure is electrically coupled to the first LED die.
1 Assignment
0 Petitions
Accused Products
Abstract
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
53 Citations
17 Claims
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1. A device comprising:
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a first light emitting diode (LED) die; a first substrate with a top surface and a bottom surface, wherein the first LED die is disposed adjacent to the top surface of the first substrate, and wherein no electrical conductor passes from the top surface of the first substrate to the bottom surface of the first substrate; a plurality of landing pads disposed on the top surface of the first substrate; an interconnect structure having a conductor, a lip and a bottom surface; and a plurality of contact pads disposed on an underside of the lip of the interconnect structure, wherein the substrate is electrically and mechanically connected to the interconnect structure only by the landing pads being attached to the contact pads, wherein the bottom surface of the interconnect structure and the bottom surface of the first substrate are substantially coplanar, and wherein the conductor of the interconnect structure is electrically coupled to the first LED die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A device comprising:
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a first light emitting diode (LED) die; a first substrate with a top surface and a bottom surface, wherein the first LED die is disposed adjacent to the to surface of the first substrate, and wherein no electrical conductor passes from the top surface of the first substrate to the bottom surface of the first substrate; a plurality of landing pads disposed on the top surface of the first substrate; an interconnect structure having a conductor, a lip and a bottom surface, wherein the first substrate has a lateral boundary, and wherein the lip extends over the first substrate within the lateral boundary; and a plurality of contact pads disposed on an underside of the lip of the interconnect structure, wherein the substrate is electrically and mechanically connected to the interconnect structure only by the landing pads being attached to the contact pads, wherein the bottom surface of the interconnect structure and the bottom surface of the first substrate are substantially coplanar, and wherein the conductor of the interconnect structure is electrically coupled to the first LED die.
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10. A method comprising:
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mounting a light emitting diode (LED) die on a substrate, wherein the substrate has a top surface and a bottom surface, wherein landing pads are disposed on the top surface of the substrate, and wherein no electrical conductor passes from the top surface of the substrate to the bottom surface of the substrate; placing each of the landing pads adjacent to one of a plurality of contact pads disposed on an underside of a lip of an interconnect structure, wherein the interconnect structure has a bottom surface, and wherein the bottom surface of the interconnect structure and the bottom surface of the substrate are substantially coplanar after the aligning; and heating the landing pads such that each of the landing pads aligns with one of the contact pads and such that the substrate is electrically and mechanically connected to the interconnect structure only by the landing pads being connected to the contact pads. - View Dependent Claims (11, 12, 13, 14)
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15. A device comprising:
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a light emitting diode (LED) die; a substrate with a top surface, a bottom surface and a lateral boundary, wherein the LED die is disposed above the substrate, and wherein no electrical conductor passes from the top surface of the substrate to the bottom surface of the substrate; a plurality of landing pads disposed on the top surface of the substrate; and means for electrically coupling the LED die to a conductor located outside the lateral boundary of the substrate, wherein the means has a plurality of contact pads, wherein the means has a bottom surface that is substantially coplanar with the bottom surface of the substrate, and wherein the substrate is electrically and mechanically connected to the means only by the landing pads being attached to the contact pads. - View Dependent Claims (16, 17)
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Specification