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Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

  • US 9,653,437 B2
  • Filed: 03/10/2016
  • Issued: 05/16/2017
  • Est. Priority Date: 01/09/2011
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a first light emitting diode (LED) die;

    a first substrate with a top surface and a bottom surface, wherein the first LED die is disposed adjacent to the top surface of the first substrate, and wherein no electrical conductor passes from the top surface of the first substrate to the bottom surface of the first substrate;

    a plurality of landing pads disposed on the top surface of the first substrate;

    an interconnect structure having a conductor, a lip and a bottom surface; and

    a plurality of contact pads disposed on an underside of the lip of the interconnect structure, wherein the substrate is electrically and mechanically connected to the interconnect structure only by the landing pads being attached to the contact pads, wherein the bottom surface of the interconnect structure and the bottom surface of the first substrate are substantially coplanar, and wherein the conductor of the interconnect structure is electrically coupled to the first LED die.

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