Cover for electronic device and method for manufacturing the same

  • US 9,658,656 B2
  • Filed: 07/31/2014
  • Issued: 05/23/2017
  • Est. Priority Date: 08/01/2013
  • Status: Active Grant
First Claim
Patent Images

1. A method for manufacturing a cover for an electronic device, comprising:

  • providing a cover base, the cover base having a main portion and a border portion beside the main portion, the border portion comprising a transparent substrate;

    forming at least one through hole in the transparent substrate; and

    forming an adhesive layer in an inner wall of the at least one through hole;

    wherein the step of forming the adhesive layer in the inner wall of the at least one through hole comprises;

    filling adhesive materials into one of the at least one through hole; and

    removing a portion of the adhesive materials from the at least one through hole.

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