Cover for electronic device and method for manufacturing the same

• US 9,658,656 B2
• Filed: 07/31/2014
• Issued: 05/23/2017
• Est. Priority Date: 08/01/2013
• Status: Active Grant

• Current Assignee: General Interface Solution Limited (General Interface Solution (GIS) Holding Ltd.), Interface Optoelectronic (ShenZhen) Co., Ltd.
• Original Assignee: General Interface Solution Limited (General Interface Solution (GIS) Holding Ltd.), Interface Optoelectronic (ShenZhen) Co., Ltd.
• Inventors: Lu, Chien-Chih, Wu, Juin-Ming, Lou, Wei-Cheng
• Primary Examiner(s): Wilson, Adrian S
• Application Number:
  US14/447,950
• Publication Number:
  US 20150036285A1
• Time in Patent Office: 1,027 Days
• Field of Search: 381391
• CPC Class Codes: G06F 1/1633 Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 1/1688 the I/O peripheral being integrated loudspeakers
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H04R 1/023 Screens for loudspeakers

Abstract

A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.

Claims

1. A method for manufacturing a cover for an electronic device, comprising:

providing a cover base, the cover base having a main portion and a border portion beside the main portion, the border portion comprising a transparent substrate;

forming at least one through hole in the transparent substrate; and

forming an adhesive layer in an inner wall of the at least one through hole;

wherein the step of forming the adhesive layer in the inner wall of the at least one through hole comprises;

filling adhesive materials into one of the at least one through hole; and

removing a portion of the adhesive materials from the at least one through hole.

2. The method of claim 1, wherein the adhesive layer is formed by jetting adhesive materials to the inner wall of the at least one through hole.

3. The method of claim 1, wherein each of the at least one through hole is circular and has a diameter of 0.1 millimeter to 0.25 millimeter.

4. The method of claim 1, wherein the thickness of the adhesive layer is between 0.01 millimeters to 0.45 millimeters.

5. The method of claim 1, wherein the color of the adhesive layer is the same as a color of the border region.

6. The method of claim 1, further comprising forming a shielding layer on a surface of the transparent substrate;

wherein when the transparent substrate of the border portion is transparent, the color of the adhesive layer is the same as a color of the shielding layer.