Submount based light emitter components and methods

• US 9,691,949 B2
• Filed: 05/30/2014
• Issued: 06/27/2017
• Est. Priority Date: 05/30/2014
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Reiherzer, Jesse Colin, Joo, Sung Chul
• Primary Examiner(s): BOOTH, RICHARD A
• Application Number:
  US14/292,331
• Publication Number:
  US 20150349218A1
• Time in Patent Office: 1,124 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.

Claims

1. A light emitter component, comprising:

a ceramic submount;

at least a first pair of electrical traces disposed on a first side of the submount;

at least a first pair of electrical contacts disposed on a second side of the submount, wherein the first pair of electrical contacts is configured to electrically communicate with the first pair of electrical traces;

at least one light emitter chip disposed on the first side of the submount, the at least one chip being configured to electrically communicate with the first pair of electrical traces; and

a non-ceramic reflector disposed about the at least one light emitter chip, wherein at least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.

2. The component of claim 1, wherein the reflector comprises a reflective wall.

3. The component of claim 2, wherein the reflective wall is polymeric.

4. The component of claim 1, wherein the reflector comprises silicone or epoxy having reflective particles dispersed therein.

5. The component of claim 4, wherein the reflective particles comprise titanium dioxide (TiO₂), zinc peroxide (ZnO₂), silicone dioxide (SiO₂), or zirconia (ZrO₂) particles.

6. The component of claim 1, wherein the at least one chip is configured to electrically communicate with the first pair of electrical traces via wirebond connectors.

7. The component of claim 6, wherein the reflector conceals the wirebond connectors.

8. The component of claim 1, further comprising an electrostatic discharge (ESD) protection device, wherein the ESD protection device is concealed by the reflector.

9. The component of claim 1, wherein the component is configured to deliver approximately 100 lumens per Watt (LPW) or more.

10. The component of claim 1, wherein the component is configured to deliver approximately 120 lumens per Watt (LPW) or more.

11. The component of claim 1, further comprising a plurality of light emitter chips.

12. The component of claim 11, wherein the plurality of light emitter chips is serially connected between the first pair of traces.

13. The component of claim 11, wherein the plurality of light emitter chips comprises multiple strings of serially connected light emitter chips, and wherein each string of light emitter chips is electrically connected in parallel between the first pair of traces.

14. The component of claim 1, wherein the ceramic submount comprises alumina, zirconia, or a mixture, composite or alloy thereof.

15. The component of claim 1, wherein the light emitter component comprises a surface mount design (SMD).

16. The component of claim 1, wherein the reflector confines phosphor that is disposed over the ceramic submount.

17. A substrate for light emitter components, the substrate comprising:

a ceramic panel; and

a plurality of adjacent light emitter components disposed over the panel, wherein each light emitter component comprises;

a plurality of electrical traces disposed on the panel;

a plurality of electrical contacts disposed on the panel, wherein at least some of the electrical contacts are configured to electrically communicate with at least some of the electrical traces;

a plurality of light emitter chips disposed on the panel, wherein at least some of the plurality of chips are configured to electrically communicate with at least some of the electrical traces; and

a plurality of non-ceramic reflectors disposed between adjacent light emitter components, at least a portion of the reflector being configured to conceal portions of the electrical traces.

18. The substrate of claim 17, wherein the panel comprises alumina, zirconia, or a mixture, composite or alloy thereof.

19. The substrate of claim 17, wherein the reflectors comprise reflective walls.

20. The substrate of claim 19, wherein the reflective walls are polymeric.

21. The substrate of claim 17, wherein the reflectors comprise silicone or epoxy having reflective particles dispersed therein.

22. The substrate of claim 21, wherein the reflective particles comprise titanium dioxide (TiO₂), zinc peroxide (ZnO₂), silicone dioxide (SiO₂), or zirconia (ZrO₂) particles.

23. The substrate of claim 17, wherein the reflectors are configured to conceal wires connecting at least some of the plurality of chips to at least some of the traces.

24. The substrate of claim 17, wherein the reflectors are configured to conceal a plurality of electrostatic discharge (ESD) protection devices that are disposed over the panel.

25. The substrate of claim 17, comprising at least 120 adjacent light emitter components.

26. The substrate of claim 17, wherein each light emitter chip is spaced apart from at least one trace by at least approximately 100 μ

m or more.

27. The substrate of claim 17, wherein each light emitter chip is spaced apart from each other light emitter chip by at least approximately 100 μ

m or more.

28. The component of claim 17, wherein the light emitter component comprises a surface mount design (SMD).

29. The component of claim 17, wherein the reflector confines phosphor that is disposed over the ceramic submount.

30. A method of providing one or more light emitter components, the method comprising:

providing a ceramic submount;

providing at least a first pair of electrical traces on a first side of the submount;

providing at least a first pair of electrical contacts on a second side of the submount, the first pair of electrical contacts being configured to electrically communicate with the first pair of electrical traces;

attaching at least one light emitter chip to the first side of the submount, the at least one chip being configured to electrically communicate with the first pair of electrical traces; and

dispensing a non-ceramic reflector about the at least one light emitter chip, wherein at least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces.

31. The method of claim 30, wherein the non-ceramic reflector comprises a polymeric reflector.

32. The method of claim 30, further comprising dispensing a filler material between opposing surfaces of the reflector.

33. The method of claim 32, wherein the filler material comprises encapsulant.

34. The method of claim 30, wherein the ceramic submount comprises alumina, zirconia, or a mixture, composite or alloy thereof.

35. The method of claim 30, wherein the reflector comprises silicone having reflective particles dispersed therein.

36. The method of claim 35, wherein the reflective particles comprise titanium dioxide (TiO₂), zinc peroxide (ZnO₂), silicone dioxide (SiO₂), or zirconia (ZrO₂) particles.

37. The method of claim 30, wherein attaching the at least one chip comprises wirebonding the at least one chip to each trace of the first pair of traces.

38. The method of claim 37, wherein the reflector conceals wirebonds for the wirebonding.

39. The method of claim 30, further comprising providing an electrostatic discharge (ESD) protection device over the first surface of the submount, and wherein the reflector is dispensed over the ESD protection device.

40. The method of claim 30, further comprising a plurality of light emitter chips, and wherein the light emitter chips are serially connected between the first pair of traces.

41. The method of claim 30, comprising sawing through at least a portion of the reflector to singulate the light emitter component.

42. The method of claim 30, comprising spacing apart each light emitter chip from the electrical traces.

43. A light emitter component, comprising:

a ceramic submount;

at least a first pair of electrical traces disposed on a first side of the submount;

at least one light emitter chip disposed on the first side of the submount, the at least one light emitter chip being configured to electrically communicate with the first pair of electrical traces; and

a non-ceramic reflector disposed about the at least one light emitter chip, wherein at least a portion of the reflector is configured to conceal each trace of the first pair of electrical traces.

44. The component of claim 43, wherein the at least one light emitter chip is spaced apart from the traces.

45. The component of claim 43, wherein the reflector is proximate an edge of the submount.