Antenna module

• US 9,705,194 B2
• Filed: 02/08/2012
• Issued: 07/11/2017
• Est. Priority Date: 08/20/2009
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Taniguchi, Katsumi, Sasaki, Jun, Ishino, Satoshi
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Islam, Hasan
• Application Number:
  US13/368,358
• Publication Number:
  US 20130038501A1
• Time in Patent Office: 1,980 Days
• Field of Search: 343860, 343720, 343862, 343852, 343700 MS, 343850, 343794, 343795, 343895, 343725, 333 32, 333 33
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

Claims

1. An antenna module comprising:

a main portion including a lamination of a plurality of flexible insulating sheets, the main portion including an antenna region, a signal transmission line region, and a connection region;

an antenna disposed on the main portion in the antenna region and configured to transmit/receive a high-frequency signal;

a connection portion disposed on the main portion in the connection region and configured to be connected to an electronic device that outputs/inputs the high-frequency signal;

a signal transmission line configured to transmit the high-frequency signal, the signal transmission line being disposed in the main portion in the signal transmission line region and having a strip line structure or a microstrip line structure;

a first impedance matching circuit disposed in the antenna region; and

a second impedance matching circuit disposed in the connection region;

wherein

the plurality of flexible insulating sheets include and define the antenna region, the signal transmission line region, and the connection region;

no impedance matching circuits are disposed in the signal transmission line region;

the antenna region, the signal transmission line region, and the connection region are arranged in this order along a longitudinal direction of the main portion;

a width of the signal transmission line region extending in a direction perpendicular or substantially perpendicular to the longitudinal direction is less than a width of the antenna region extending in the direction perpendicular or substantially perpendicular to the longitudinal direction and is less than a width of the connection region extending in the direction perpendicular or substantially perpendicular to the longitudinal direction;

the first impedance matching circuit includes a line-shaped conductor and a ground conductor, and does not include any chip elements; and

the second impedance matching circuit includes at least one of a chip capacitor and a chip coil.

2. The antenna module according to claim 1, wherein the electronic device has a first characteristic impedance, and the signal transmission line has a second characteristic impedance smaller than the first characteristic impedance.

3. The antenna module according to claim 2, wherein an antenna port defining a connection port between the antenna and the first impedance matching circuit has a characteristic impedance smaller than the first characteristic impedance and the second characteristic impedance.

4. The antenna module according to claim 1, wherein

the first impedance matching circuit provides impedance matching between a first impedance of the antenna seen from one end of the signal transmission line and a second impedance of the signal transmission line seen from the one end of the signal transmission line;

and

the second impedance matching circuit provides impedance matching between a third impedance of the connection portion in a state in which the electronic device is connected to the connection portion seen from the other end of the signal transmission line and a fourth impedance of the signal transmission line seen from the other end of the signal transmission line.

5. The antenna module according to claim 4, wherein the first impedance and the second impedance are conjugate with each other, and the third impedance and the fourth impedance are conjugate with each other.

6. The antenna module according to claim 1, wherein each of the insulating sheets has a thickness equal to or more than about 10 μ

m and equal to or less than about 100 μ

m.

7. The antenna module according to claim 1, further comprising:

a first ground conductor disposed on one of the plurality of flexible insulating sheets;

a second ground conductor disposed on another one of the plurality of flexible insulating sheets; and

at least one via-hole conductor extending in a lamination direction of the plurality of flexible insulating sheets and connecting the first ground conductor to the second ground conductor;

wherein

the signal transmission line region of the main portion does not contain any of the at least one via-hole conductor.