Hybrid infrared sensor array having heterogeneous infrared sensors

• US 9,706,138 B2
• Filed: 11/26/2013
• Issued: 07/11/2017
• Est. Priority Date: 04/23/2010
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Distelzweig, John H., Teich, Andrew C., Terre, William A., Boulanger, Pierre, Frank, Jeffrey D.
• Primary Examiner(s): Porta, David
• Assistant Examiner(s): Gunberg, Edwin
• Application Number:
  US14/091,266
• Publication Number:
  US 20140085482A1
• Time in Patent Office: 1,323 Days
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 5/025 Interfacing a pyrometer to an external device or network; User interface
• CPC Class Codes: G01J 5/026 Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control
• CPC Class Codes: G01J 5/04 Casings
• CPC Class Codes: G01J 5/0846 having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
• CPC Class Codes: G01J 5/12 using thermoelectric elements, e.g. thermocouples
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/80 Calibration using comparison with reference sources G01J5/52
• CPC Class Codes: H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Claims

1. An infrared sensor assembly comprising:

an array of infrared sensors, the array comprising;

a plurality of microbolometers configured to image a scene, and

at least one non-bolometric sensor configured to detect infrared radiation from at least a portion of the scene, the at least one non-bolometric sensor being provided among the array in place of one or more microbolometers; and

a substrate coupled to the array, the substrate comprising;

a readout integrated circuit (ROIC) configured to provide signals from the microbolometers corresponding to a captured infrared image of the scene, the captured infrared image containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor among the array, and

an output circuit configured to provide signals from the at least one non-bolometric sensor,

wherein the infrared sensor assembly is configured to generate a blended infrared image that has the at least one blind spot filled based on the captured infrared image and the signals from the at least one non-bolometric sensor.

2. The infrared sensor assembly of claim 1, wherein the at least one non-bolometric sensor comprises a thermopile infrared sensor.

3. The infrared sensor assembly of claim 2, wherein the thermopile infrared sensor comprises a thermocouple of two dissimilar materials joined together at two junctions, and wherein the microbolometers are of a same material as one of the two dissimilar materials.

4. The infrared sensor assembly of claim 1, wherein the at least one non-bolometric sensor comprises a pyroelectric detector.

5. The infrared sensor assembly of claim 1, wherein the at least one non-bolometric sensor is disposed at a substantially central area of the array.

6. The infrared sensor assembly of claim 1, wherein the at least one non-bolometric sensor comprises a plurality of non-bolometric sensors.

7. The infrared sensor assembly of claim 6, wherein one or more of the plurality of non-bolometric sensors are disposed in one or more corners of the array.

8. The infrared sensor assembly of claim 1, wherein the at least one non-bolometric sensor is disposed in a corner of the array.

9. The infrared sensor assembly of claim 1, wherein the processor is configured to generate the blended infrared image at least by converting the output signal from the at least one non-bolometric sensor into pixel data and combining the pixel data with the captured infrared image.

10. The infrared sensor assembly of claim 1, wherein the substrate comprises bond pads electrically connected to the output circuit and configured to form electrical connection with external electrical contacts to transmit the signals from the output circuit.

11. A method comprising:

receiving, at an array of infrared sensors, infrared radiation from a scene, wherein the array comprises a plurality of microbolometers and at least one non-bolometric sensor, the at least one non-bolometric sensor being provided among the array in place of one or more of the plurality of microbolometers;

providing, by a readout integrated circuit (ROIC) communicatively coupled to the microbolometers, infrared image data representing an infrared image of the scene, the infrared image containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor on the array;

providing, by an output circuit communicatively coupled to the at least one non-bolometric sensor, temperature information associated with the scene, wherein the ROIC and the output circuit are provided on a substrate; and

generating a blended infrared image data representing a blended infrared image that has the at least one blind spot filled, based on the infrared image data and the temperature information.

12. The method of claim 11, wherein the temperature information is a spot temperature reading of a spot in the scene, the infrared radiation received at the at least one non-bolometric sensor corresponding to infrared radiation emitted from the spot.

13. The method of claim 11, wherein:

the at least one non-bolometric sensor comprises a plurality of non-bolometric sensors;

the providing the temperature information comprises selecting one of the plurality of non-bolometric sensors and obtaining a spot temperature reading based on the infrared radiation received at the selected one of the non-bolometric sensors; and

the temperature information is the spot temperature reading.

14. The method of claim 11, wherein:

the at least one non-bolometric sensor comprises a plurality of non-bolometric sensors;

the providing the temperature information comprises determining an average temperature based on the infrared radiation received at two or more of the plurality of non-bolometric sensors; and

the temperature information is the average temperature.

15. The method of claim 11, wherein:

the at least one non-bolometric sensor comprises a plurality of non-bolometric sensors;

the providing the temperature information comprises determining a temperature gradient associate with the scene based on the infrared radiation received at two or more of the plurality of non-bolometric sensors; and

the temperature information is the temperature gradient.

16. The method of claim 11, wherein the generating of the blended infrared image data comprises converting the temperature information into infrared pixel data and combining the infrared pixel data with the infrared image data to fill the at least one blind spot.

17. The method of claim 11, wherein the scene is of substantially uniform temperature, the method further comprising radiometrically calibrating the microbolometers based on the temperature information provided by the output circuit and the at least one non-bolometric sensor.

18. A method of providing a hybrid infrared sensor assembly, the method comprising:

fabricating microbolometers to form a focal plane array (FPA), the FPA having at least one portion without microbolometers, the at least one portion being provided among the FPA in place of one or more of the microbolometers;

fabricating at least one non-bolometric sensor on the at least one portion of the FPA in place of the one or more of the microbolometers;

providing a readout integrated circuit (ROIC) electrically coupled to the microbolometers to generate output signals corresponding to an image of infrared radiation incident on the microbolometers, the image of infrared radiation containing at least one blind spot corresponding to the location of the at least one non-bolometric sensor on the FPA; and

providing bond pads electrically connected to the at least one non-bolometric sensor and configured to form electrical connection with an external device,

wherein the external device is configured to generate a blended infrared image that has the at least one blind spot filled based on the image of infrared radiation and signals from the at least one non-bolometric sensor.

19. The method of claim 18, wherein:

the FPA, the ROIC, and the bond pads are fabricated on a substrate;

the at least one non-bolometric sensor comprises a thermocouple of at least two dissimilar materials; and

the microbolometers are of same material as one of the at least two dissimilar materials of the thermocouple.