Light-emitting device and lighting device provided with the same

• US 9,735,133 B2
• Filed: 10/11/2016
• Issued: 08/15/2017
• Est. Priority Date: 09/30/2010
• Status: Active Grant

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hata, Toshio, Nada, Tomokazu, Ishizaki, Shinya, Agatani, Makoto
• Primary Examiner(s): Santiago, Mariceli
• Application Number:
  US15/290,232
• Publication Number:
  US 20170033089A1
• Time in Patent Office: 308 Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 2201/0391 Using different types of conductors
• CPC Class Codes: H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.

Claims

1. A light-emitting device comprising:

a substrate;

a light-emitting part formed on the substrate;

a sealing body to cover the light-emitting part;

a first wiring pattern formed on the substrate, the first wiring pattern being used for an anode-side connection; and

a second wiring pattern formed on the substrate, the second wiring pattern being used for a cathode-side connection, wherein

the light-emitting part includes a plurality of LED chips arranged in at least two LED rows including a first row and a second row, the number of the LED chips in the first row being smaller than that in the second row,

a plurality of series circuits, each of which is composed of the same number of the LED chips connected in series as the others, are formed, each of the series circuits having one end connected to the first wiring pattern and the other end connected to the second wiring pattern, and

at least one of the series circuits has a portion where an electric connection is made between one of the LED chips in the first row and one of the LED chips in a row adjacent to the first row.

2. The light-emitting device of claim 1, wherein

the first wiring pattern and the second wiring pattern are formed in a periphery of the light-emitting part on the substrate, respectively,

the first wiring pattern electrically connects to a land being used for an anode-side external electric connection, and

the second wiring pattern electrically connects to another land being used for a cathode-side external electric connection.

3. The light-emitting device of claim 1, wherein

the first wiring pattern and the second wiring pattern are arranged so as to be opposed to each other on the substrate.

4. The light-emitting device of claim 1, further comprising a resin dam formed so as to surround the light-emitting part, wherein

the sealing body is filled inside the resin dam.

5. The light-emitting device of claim 4, wherein

the resin dam has a circular ring shape.

6. The light-emitting device of claim 5, wherein

the first wiring pattern and the second wiring pattern have respective arc shapes each constituting a part of the circular ring.

7. The light-emitting device of claim 4, further comprising at least one first wire and at least one second wire, wherein

one end of each of the series circuits and the first wiring pattern are connected through the first wire,

the other end of each of the series circuits and the second wiring pattern are connected through the second wire, and

the resin dam is formed so as to cover a part of the first wire, a part of the second wire, the first wiring pattern, and the second wiring pattern.

8. The light-emitting device of claim 4, further comprising a protection element arranged under the resin dam.

9. The light-emitting device of claim 1, wherein the sealing body is composed of a phosphor containing resin.

10. The light-emitting device of claim 1, wherein an outline of a plurality of the LED rows constituting the light-emitting part is substantially similar in shape as an outline of the sealing body.