Wireless energy transfer resonator thermal management

• US 9,748,039 B2
• Filed: 01/30/2015
• Issued: 08/29/2017
• Est. Priority Date: 09/27/2008
• Status: Active Grant

• Current Assignee: WiTricity Corporation
• Original Assignee: WiTricity Corporation
• Inventors: Kurs, Andre B., Kesler, Morris P., Hall, Katherine L., Fiorello, Ron, MacDonald, Matthew J.
• Primary Examiner(s): KAPLAN, HAL IRA
• Application Number:
  US14/609,962
• Publication Number:
  US 20150235762A1
• Time in Patent Office: 942 Days
• Field of Search: 307104, 320108
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/12 of the resonant type
• CPC Class Codes: H02J 50/50 using additional energy repeaters between transmitting devices and receiving devices
• CPC Class Codes: H02J 50/80 involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
• CPC Class Codes: H03H 7/40 Automatic matching of load impedance to source impedance
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A resonator structure for wireless power transfer includes a first piece and a second piece of magnetic material disposed adjacent to one another, a spacer disposed between the first and second pieces of magnetic material forming a gap of 1 mm or less between the first and second pieces of magnetic material, and an electrical conductor wound to form a plurality of loops. The electrical conductor is disposed on the first and second pieces of magnetic material. The resonator structure includes a thermal conductor positioned in contact with the electrical conductor and at least one of the first and second pieces of magnetic material.

Claims

1. A resonator structure for wireless power transfer, the structure comprising:

a first piece and a second piece of magnetic material disposed adjacent to one another;

a spacer disposed between the first and second pieces of magnetic material forming a gap of 1 mm or less between the first and second pieces of magnetic material;

an electrical conductor wound to form a plurality of loops, the electrical conductor disposed on the first and second pieces of magnetic material; and

a thermal conductor positioned in contact with the electrical conductor and at least one of the first and second pieces of magnetic material.

2. The structure of claim 1 wherein the spacer is made of a rigid material.

3. The structure of claim 1 wherein the spacer is made of a flexible material.

4. The structure of claim 1 wherein edges of the first and second pieces of magnetic material are covered with an electrical insulator.

5. The structure of claim 1 wherein the spacer is integrated into a packaging of the resonator structure.

6. The structure of claim 1 wherein cooling is used to maintain the temperature of the gap between the first and second pieces of magnetic material below a critical temperature.

7. The structure of claim 1 further comprising a heatsink positioned adjacent to the first and second pieces of magnetic material.

8. The structure of claim 7 further comprising a second thermal conductor positioned in contact with at least one of the first and second pieces of magnetic material and the heatsink.

9. The structure of claim 7 wherein the thermal conductor is positioned in between the heatsink and at least one of the first and second pieces of magnetic material.

10. The structure of claim 1 wherein a thermal conductivity of the thermal conductor is at least approximately 5 W/(K·

m).

11. The structure of claim 1 wherein the thermal conductor is positioned between the electrical conductor and at least one of the first and second pieces of magnetic material.

12. The structure of claim 1 wherein the thermal conductor is in contact with the first and second pieces of magnetic material.

13. A resonator structure for wireless power transfer, the structure comprising:

a first piece and a second piece of magnetic material;

an electrical conductor wound to form a plurality of loops, the electrical conductor disposed on the first and second pieces of magnetic material;

a heatsink;

a first thermal conductor positioned in contact with the electrical conductor and at least one of the first and second pieces of magnetic material;

a second thermal conductor positioned in contact with the heatsink and at least one of the first and second pieces of magnetic material.

14. The structure of claim 13 wherein the first thermal conductor is positioned between the electrical conductor and the at least one of the first and second pieces of magnetic material.

15. The structure of claim 13 wherein the second thermal conductor is positioned between the heatsink and the at least one of the first and second pieces of magnetic material.

16. The structure of claim 13 wherein a thermal conductivity of the first thermal conductor is at least approximately 5 W/(K·

m).

17. The structure of claim 13 wherein a thermal conductivity of the second thermal conductor is at least approximately 5 W/(K·

m).

18. The structure of claim 13 wherein the first thermal conductor is in contact with the first and second pieces of magnetic material.

19. The structure of claim 13 wherein the second thermal conductor is in contact with the first and second pieces of magnetic material.

20. The structure of claim 13 wherein cooling is used to maintain the temperature of a gap between the first and second pieces of magnetic material below a critical temperature.