Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

• US 9,751,752 B2
• Filed: 11/30/2016
• Issued: 09/05/2017
• Est. Priority Date: 03/18/2005
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Nasiri, Steven S., Flannery, Jr., Anthony F.
• Primary Examiner(s): Blum, David S
• Application Number:
  US15/364,478
• Publication Number:
  US 20170073223A1
• Time in Patent Office: 279 Days
• Field of Search: 257 62, 257414, 257417
• CPC Class Codes: B23K 20/023 Thermo-compression bonding
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/094 Feed-through, via
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/035 Soldering
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: H01L 21/187 by direct bonding

Abstract

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.

Claims

1. A microelectromechanical systems (MEMS) device comprising:

a first substrate comprising a MEMS feature and a patterned germanium layer in direct contact with the first substrate; and

a second substrate comprising a patterned aluminum layer, wherein germanium of the patterned germanium layer of the first substrate is in direct contact with and matched to aluminum of the patterned aluminum layer of the second substrate to form a hermetic seal ring, wherein the patterned aluminum layer is properly patterned to match the patterned germanium layer in the area of the hermetic seal ring.

2. The MEMS device of claim 1, wherein the second substrate further comprises an electrical contact associated with the patterned aluminum layer, coupled with an integrated circuit within the second substrate, and located within an outer perimeter of the hermetic seal ring.

3. The MEMS device of claim 2, wherein the first substrate and the second substrate are electrically connected via an inter-substrate electrical contact comprising the electrical contact and the patterned germanium layer of the first substrate.

4. The MEMS device of claim 3, wherein the integrated circuit has a multilayer metalization electrically coupled with at least a portion of the patterned aluminum layer and configured to allow electrical under pass feedthrough via the inter-substrate electrical contact from the integrated circuit to the MEMS feature.

5. The MEMS device of claim 3, wherein the first substrate further comprises at least one via configured to provide electric feedthrough of signals to the one electrical contact of the second substrate.

6. The MEMS device of claim 1, wherein at least one of the first substrate or the second substrate comprises at least one of a silicon substrate, a multiple layer of silicon substrates, or a substrate comprising at least one of gallium arsenide (GaAs), indium phosphide (InPh), silicon germanium (SiGe), or glass.

7. A wafer structure comprising:

a first substrate comprising at least one microelectromechanical systems (MEMS) feature, wherein the first substrate further comprises at least one patterned germanium layer; and

a second substrate comprising at least one patterned aluminum layer and one electrical contact, wherein the at least one patterned germanium layer is bonded to the at least one patterned aluminum layer to create an inter-substrate electrical contact and a mechanical contact between the first substrate and the second substrate.

8. The wafer structure of claim 7, wherein at least one of the first substrate or the second substrate comprises at least one of a silicon substrate, a multiple layer of silicon substrates, or a substrate comprising at least one of gallium arsenide (GaAs), indium phosphide (InPh), silicon germanium (SiGe), or glass.

9. The wafer structure of claim 7, wherein the first substrate comprises MEMS structures and a cavity.

10. The wafer structure of claim 7, wherein the second substrate comprises an integrated circuit.

11. The wafer structure of claim 10, wherein the integrated circuit has a multilayer metalization electrically coupled with at least a portion of the at least one patterned aluminum layer and configured to allow electrical under pass feedthrough via the inter-substrate electrical contact to the integrated circuit.

12. The wafer structure of claim 11, wherein a plurality of contact pads are located outside an outer perimeter of a hermetic sealing ring that provides a hermetic seal associated with the mechanical contact and wherein at least one of the plurality of contact pads is electrically coupled to the one electrical contact of the second substrate located within the outer perimeter of the hermetic sealing ring.

13. The wafer structure of claim 12, wherein the at least one patterned germanium layer and the at least one patterned aluminum layer are bonded to provide the hermetic seal.

14. The wafer structure of claim 10, wherein the first substrate further comprises at least one via configured to provide electric feedthrough of signals to the one electrical contact of the second substrate.

15. The wafer structure of claim 7, wherein the at least one patterned germanium layer is bonded to the at least one patterned aluminum layer via an eutectic composition of aluminum and germanium.

16. A wafer structure comprising:

a first substrate comprising at least one microelectromechanical systems (MEMS) feature, wherein the first substrate further comprises at least one patterned germanium layer and at least one via configured to provide electric feedthrough of signals; and

a second substrate comprising at least one patterned aluminum layer and one electrical contact, wherein the at least one patterned germanium layer is bonded to the at least one patterned aluminum to mechanically couple the first substrate to the second substrate via a hermetic seal ring and to electrically couple the at least one via of the first substrate to the one electrical contact of the second substrate within the hermetic seal ring.

17. The wafer structure of claim 16, wherein at least one of the first substrate or the second substrate comprises at least one of a silicon substrate, a multiple layer of silicon substrates, or a substrate comprising at least one of gallium arsenide (GaAs), indium phosphide (InPh), silicon germanium (SiGe), or glass.

18. The wafer structure of claim 16, wherein the second substrate comprises an integrated circuit having a multilayer metalization electrically coupled with at least a portion of the at least one patterned aluminum layer and configured to provide the one electrical contact to facilitate the electric feedthrough of signals between the first substrate and the second substrate.