LED module with high index lens

• US 9,755,124 B2
• Filed: 03/22/2016
• Issued: 09/05/2017
• Est. Priority Date: 09/17/2009
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds LLC (Apollo Global Management, Inc.), Koninklijke Philips N.V.
• Inventors: Bierhuizen, Serge J., Wang, Nanze Patrick, Eng, Gregory W., Sun, Decai, Wei, Yajun
• Primary Examiner(s): Parker, Kenneth
• Assistant Examiner(s): Jiang, Fang-Xing
• Application Number:
  US15/077,255
• Publication Number:
  US 20160240754A1
• Time in Patent Office: 532 Days
• CPC Class Codes: H01L 25/13 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.

Claims

1. A method for manufacturing light-emitting diode (LED) modules in parallel, comprising:

molding a lens array of lenses wherein each lens is adjoined with neighboring lenses;

molding a housing array of housing bodies wherein each housing body is adjoined with neighboring housing bodies;

bonding the lens array'"'"'s bottom surface to the housing array'"'"'s top surface to form a combined array;

attaching LEDs to the housings in the combined array; and

singulating the combined array to form individual LED modules.

2. The method of claim 1, further comprising:

bonding a metal pad array to the housing array or insert molding the metal pad array with the housing array to form metal pads on the back of the housings.

3. The method of claim 2, further comprising:

forming the metal pad array with tabs for positioning the LEDs in the housing bodies.

4. The method of claim 1, wherein the LEDs each comprises a submount and one or more LED dies on the submount, and the lenses each has a bottom surface larger than a top surface of each LED.

5. The method of claim 1, further comprising:

fixing wavelength converting elements to bottom of the lenses in the lens array, wherein;

each housing body comprises a top opening and a bottom opening coupled to the top opening, the top and the bottom openings comprise reflective or scattering sidewalls;

bonding the lens array and the housing array comprises locates the wavelength converting elements in the top opening of the housings; and

attaching the LED to the housings in the combined array comprises locating the LED in the bottom openings of the housing bodies.

6. The method of claim 1, further comprising:

separating one or more the lens array of lenses and the housing array into smaller arrays for processing.