Light emitting device

  • US 9,768,367 B2
  • Filed: 04/27/2016
  • Issued: 09/19/2017
  • Est. Priority Date: 08/28/2014
  • Status: Active Grant
First Claim
Patent Images

1. A light emitting device, comprising:

  • a first bonding pad configured to be soldered to a mounting substrate;

    a first electrode electrically connected to the first bonding pad via a first connection electrode;

    a first conductive type semiconductor layer connected to the first electrode; and

    a solder ball contactable region and a non-conductive region,wherein;

    the first bonding pad comprises at least two elongate, opposed regions disposed in the solder ball contactable region; and

    the non-conductive region is disposed between the at least two elongate, opposed regions.

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