Semiconductor device and method of manufacturing the same
First Claim
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1. A method of manufacturing a semiconductor device, comprising:
- forming a plurality of ferroelectric capacitors, each of the ferroelectric capacitors including a bottom electrode, a capacitor insulating film, and an top electrode;
forming a plurality of switching elements, each of the switching elements being connected to one of the ferroelectric capacitors, respectively;
forming a plurality of word lines, each of the word lines switching on and off two or more of the switching elements;
forming a plurality of bit lines, each of the bit lines being connected to two or more of the switching elements; and
forming a plate line that is connected to ferroelectric capacitors selected from the plurality of ferroelectric capacitors and covers the selected ferroelectric capacitors and regions between the selected ferroelectric capacitors from above the top electrodes, whereinthe plurality of ferroelectric capacitors is within an outline of the plate line in a plan view.
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Abstract
An embodiment of a semiconductor device includes a plate line that is connected to ferroelectric capacitors selected from a plurality of ferroelectric capacitors and covers the selected ferroelectric capacitors and regions between the selected ferroelectric capacitors from above top electrodes.
14 Citations
9 Claims
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1. A method of manufacturing a semiconductor device, comprising:
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forming a plurality of ferroelectric capacitors, each of the ferroelectric capacitors including a bottom electrode, a capacitor insulating film, and an top electrode; forming a plurality of switching elements, each of the switching elements being connected to one of the ferroelectric capacitors, respectively; forming a plurality of word lines, each of the word lines switching on and off two or more of the switching elements; forming a plurality of bit lines, each of the bit lines being connected to two or more of the switching elements; and forming a plate line that is connected to ferroelectric capacitors selected from the plurality of ferroelectric capacitors and covers the selected ferroelectric capacitors and regions between the selected ferroelectric capacitors from above the top electrodes, wherein the plurality of ferroelectric capacitors is within an outline of the plate line in a plan view. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification