Flexible system-in-package solutions for wearable devices
First Claim
1. An integrated circuit (IC) package comprising:
- a flexible substrate;
a plurality of dies coupled with the flexible substrate;
a first encapsulation material, having a first rigidity, disposed on the flexible substrate at locations on the flexible substrate to at least partially encapsulate each die of the plurality dies;
a second encapsulation material, having a second rigidity, disposed on the flexible substrate, wherein the second rigidity and the first rigidity are different from one another; and
electrical routing features that electrically couple at least a first die of the plurality of dies with a second die of the plurality of dies, wherein the electrical routing features are at least partially encapsulated by the second encapsulation material.
1 Assignment
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Accused Products
Abstract
Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.
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Citations
24 Claims
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1. An integrated circuit (IC) package comprising:
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a flexible substrate; a plurality of dies coupled with the flexible substrate; a first encapsulation material, having a first rigidity, disposed on the flexible substrate at locations on the flexible substrate to at least partially encapsulate each die of the plurality dies; a second encapsulation material, having a second rigidity, disposed on the flexible substrate, wherein the second rigidity and the first rigidity are different from one another; and electrical routing features that electrically couple at least a first die of the plurality of dies with a second die of the plurality of dies, wherein the electrical routing features are at least partially encapsulated by the second encapsulation material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of assembling an IC package comprising:
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coupling a plurality of dies with a flexible substrate; depositing a first encapsulation material, having a first rigidity, on the flexible substrate at locations on the flexible substrate to at least partially encapsulate each die of the plurality dies; depositing a second encapsulation material, having a second rigidity, on the flexible substrate, wherein the second rigidity and the first rigidity are different from one another; and providing electrical routing features that electrically couple at least a first die of the plurality of dies with a second die of the plurality of dies, wherein providing electrical routing features includes at least partially encapsulating the electrical routing features by the second encapsulation material. - View Dependent Claims (22, 23, 24)
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Specification