Organic light emitting diode array substrate, organic light emitting diode display device having the same, and manufacturing method thereof

• US 9,780,153 B2
• Filed: 12/10/2015
• Issued: 10/03/2017
• Est. Priority Date: 05/06/2015
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Gao, Jing
• Primary Examiner(s): Nguyen, Thinh T
• Application Number:
  US15/035,754
• Publication Number:
  US 20170104043A1
• Time in Patent Office: 663 Days
• Field of Search: 257 40, 257 59, 257 72, 257642, 257E39007, 257E51001, 438 82, 438 99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H10K 50/818 Reflective anodes, e.g. ITO combined with thick metallic layers
• CPC Class Codes: H10K 50/824 combined with auxiliary electrodes
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/122 Pixel-defining structures or layers, e.g. banks
• CPC Class Codes: H10K 59/124 Insulating layers formed between TFT elements and OLED elements
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The present application discloses an organic light emitting diode array substrate comprising a base substrate; a first electrode; a second electrode; and a pixel definition layer. The pixel definition layer comprises a first insulating layer comprising a plurality of first insulating units; a second insulating layer comprising a plurality of second insulating units; and a conductive layer comprising a plurality of interconnected conductive units sandwiched by the first insulating layer and the second insulating layer.

Claims

1. An organic light emitting diode array substrate, comprising:

a base substrate;

a first electrode;

a second electrode; and

a pixel definition layer comprising;

a first insulating layer comprising a plurality of first insulating units;

a second insulating layer comprising a plurality of second insulating units; and

a conductive layer comprising a plurality of interconnected conductive units sandwiched by the first insulating layer and the second insulating layer;

wherein each of the plurality of interconnected conductive units is sandwiched by one of the plurality of first insulating units and one of the plurality of second insulating units;

a projection of at least one of the plurality of interconnected conductive units on the base substrate is covered by those of one of the plurality of first insulating units and one of the plurality of second insulating units;

the first insulating layer and the second insulating layer are between the first electrode layer and the second electrode layer.

2. The organic light emitting diode array substrate of claim 1, wherein the conductive layer is covered by the first insulating layer and the second insulating layer in a non-peripheral region of the organic light emitting diode array substrate.

3. The organic light emitting diode array substrate of claim 1, wherein the conductive layer is connected to the first electrode in a peripheral region of the organic light emitting diode array substrate.

4. The organic light emitting diode array substrate of claim 1, wherein the conductive layer is insulated from the second electrode by the first insulating layer.

5. The organic light emitting diode array substrate of claim 1, wherein the second electrode, the first insulating layer, the conductive layer, the second insulating layer, and the first electrode are sequentially on the base substrate.

6. The organic light emitting diode array substrate of claim 1, further comprising:

a thin film transistor; and

an organic light emitting layer.

7. The organic light emitting diode array substrate of claim 6, wherein the thin film transistor, the second electrode, the first insulating layer, the conductive layer, the second insulating layer, the organic light emitting layer, and the first electrode are sequentially on the base substrate.

8. The organic light emitting diode array substrate of claim 6, wherein the conductive layer is insulated from the organic light emitting layer by the second insulating layer.

9. The organic light emitting diode array substrate of claim 3, wherein the conductive layer comprises, in the peripheral region of the organic light emitting diode array substrate, a portion not covered by the second insulating layer, the portion is connected to the first electrode.

10. The organic light emitting diode array substrate of claim 3, wherein the second insulating layer covers the conductive layer in the peripheral region of the organic light emitting diode array substrate, the first electrode is connected to the conductive layer through a via in the second insulating layer in the peripheral region of the organic light emitting diode array substrate.

11. The organic light emitting diode array substrate of claim 1, wherein the second insulating layer is made of a second insulating material comprising an inorganic insulating material;

and the conductive layer is made of a conductive material comprising one or more of indium tin oxide, molybdenum, aluminum, and neodymium.

12. An organic light emitting diode display device, comprising an organic light emitting diode array substrate of claim 1.

13. A method of manufacturing an organic light emitting diode array substrate, comprising:

forming a second electrode on a base substrate;

forming a pixel definition layer comprising;

forming a first insulating layer comprising a plurality of first insulating units;

forming a second insulating layer comprising a plurality of second insulating units; and

forming a conductive layer comprising a plurality of interconnected conductive units sandwiched by the first insulating layer and the second insulating layer;

forming a first electrode; and

connecting the conductive layer to the first electrode;

wherein each of the plurality of interconnected conductive units is formed to be sandwiched by one of the plurality of first insulating units and one of the plurality of second insulating units;

a projection of at least one of the plurality of interconnected conductive units on the base substrate is covered by those of one of the plurality of first insulating units and one of the plurality of second insulating units; and

the first insulating layer and the second insulating layer are formed to be between the first electrode layer and the second electrode layer.

14. The method of claim 13, wherein the conductive layer is formed to be covered by the first insulating layer and the second insulating layer in a non-peripheral region of the organic light emitting diode array substrate.

15. The method of claim 13, wherein the conductive layer is insulated from the second electrode by the first insulating layer.

16. The method of claim 13, wherein the second electrode, the first insulating layer, the conductive layer, the second insulating layer, and the first electrode are sequentially on the base substrate.

17. The method of claim 13, further comprising:

forming a thin film transistor on the base substrate prior to forming the first insulating layer; and

forming an organic light emitting layer prior to forming the first electrode and after forming a second insulating layer.

18. The method of claim 17, wherein the conductive layer is insulated from the organic light emitting layer by the second insulating layer.

19. The method of claim 13, wherein the second insulating layer covers the conductive layer in a peripheral region of the organic light emitting diode array substrate;

and

the method further comprising;

forming a via in the second insulating layer in the peripheral region of the organic light emitting diode array substrate, the first electrode is connected to the conductive layer through the via.

20. The method of claim 19, wherein, after forming the second insulating layer, the step of forming the organic light emitting layer comprises:

masking the via using a mask; and

evaporation coating the base substrate with an organic light emitting material.