Light emitting device and method of fabricating the same
DCFirst Claim
1. A light emitting device, comprising:
- an n-type semiconductor layer;
a p-type semiconductor layer;
an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer; and
an electron blocking layer disposed between the p-type semiconductor layer and the active layer,wherein;
the p-type semiconductor layer includes a hole injection layer, a p-type contact layer, and a hole transport layer disposed between the hole injection layer and the p-type contact layer, andthe hole transport layer includes first and second low-doped layers and at least one intermediate doped layer disposed between the first and second low-doped layers, wherein the first low-doped layer adjoins the p-type contact layer and wherein dopant concentrations of the first and second low-doped layers are less than a dopant concentration of the at least one intermediate doped layer, wherein the dopant concentration of the first low-doped layer decreases with increasing distance from the intermediate doped layer and then increases with decreasing distance to the p-type contact layer.
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Abstract
A light emitting device is provided to include an n-type semiconductor layer, a p-type semiconductor layer, an active layer, and an electron blocking layer disposed between the p-type semiconductor layer and the active layer. The p-type semiconductor layer includes a hole injection layer, a p-type contact layer, and a hole transport layer. The hole transport layer includes a plurality of undoped layers and at least one intermediate doped layer disposed between the undoped layers. At least one of the undoped layers includes a zone in which hole concentration decreases with increasing distance from the hole injection layer or the p-type contact layer, and the intermediate doped layer is disposed to be at least partially overlapped with a region of the hole transport layer, the region having the hole concentration of 62% to 87% of the hole concentration of the p-type contact layer.
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Citations
20 Claims
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1. A light emitting device, comprising:
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an n-type semiconductor layer; a p-type semiconductor layer; an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer; and an electron blocking layer disposed between the p-type semiconductor layer and the active layer, wherein; the p-type semiconductor layer includes a hole injection layer, a p-type contact layer, and a hole transport layer disposed between the hole injection layer and the p-type contact layer, and the hole transport layer includes first and second low-doped layers and at least one intermediate doped layer disposed between the first and second low-doped layers, wherein the first low-doped layer adjoins the p-type contact layer and wherein dopant concentrations of the first and second low-doped layers are less than a dopant concentration of the at least one intermediate doped layer, wherein the dopant concentration of the first low-doped layer decreases with increasing distance from the intermediate doped layer and then increases with decreasing distance to the p-type contact layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a light emitting device, including:
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growing an n-type semiconductor layer, an active layer, an electron blocking layer, and a p-type semiconductor layer on a substrate within a chamber, wherein the growing the p-type semiconductor layer includes; growing a hole injection layer on the substrate within the chamber by introducing an N source gas, a Ga source gas, an Mg source gas, N2 gas, and H2 gas into the chamber; growing an undoped layer on the hole injection layer by introducing an N source gas, a Ga source gas and N2 gas into the chamber while blocking introducing of the Mg source gas and H2 gas; growing an intermediate doped layer on the undoped layer by introducing an N source gas, a Ga source gas, N2 gas and an Mg source gas into the chamber; growing an undoped layer on the intermediate doped layer by introducing an N source gas, a Ga source gas, and N2 gas into the chamber while blocking introducing of the Mg source gas; and growing a p-type contact layer on the undoped layers by introducing an N source gas, a Ga source gas, an Mg source gas, N2 gas and H2 gas into the chamber. - View Dependent Claims (11, 12, 13)
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14. A light emitting device, comprising:
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a substrate; an n-type semiconductor layer formed over the substrate; an active layer formed over the n-type semiconductor layer; a p-type semiconductor layer formed over the active layer, wherein the p-type semiconductor layer includes first and second low-doped layers and a doped layer disposed between the low-doped layers and the second low-doped layers include a hole concentration decreasing with increasing distance from the active layer and then increasing with decreasing distance to the doped layer; and a p-type contact layer formed over the doped layer, and wherein the first low-doped layer adjoins the p-type contact layer and has a dopant concentration less than that of the doped layer. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification