Solder alloy

• US 9,808,890 B2
• Filed: 04/17/2013
• Issued: 11/07/2017
• Est. Priority Date: 04/18/2012
• Status: Active Grant

• Current Assignee: Senju Metal Industry Company Limited
• Original Assignee: Senju Metal Industry Company Limited
• Inventors: Nomura, Hikaru, Yoshikawa, Shunsaku
• Primary Examiner(s): King, Roy
• Assistant Examiner(s): KIECHLE, CAITLIN ANNE
• Application Number:
  US14/394,887
• Publication Number:
  US 20150086263A1
• Time in Patent Office: 1,665 Days
• CPC Class Codes: B23K 1/00 Soldering, e.g. brazing, or unsoldering B23K3/00 takes precedence; characterised only by the use of special materials or media B23K35/00; dip or wave soldering in the manufacture of printed circuits H05K3/34
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 2101/00 Articles made by soldering, welding or cutting
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: B23K 2103/10 Aluminium or alloys thereof
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/282 Zn as the principal constituent
• CPC Class Codes: C22C 13/00 Alloys based on tin

Abstract

A solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn, a solder joint made of the solder alloy, and a jointing method using the solder alloy.

Claims

1. A solder joint made of a solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass %, Ni of 0.005 through 0.3 mass % and balance of Sn,

wherein the solder joint forms a metal junction between the alloy and an Al surface or an Ni surface.

2. The solder joint claimed in claim 1, wherein mass ratio of Al and Ti in the solder alloy is 0.4≦

Al/(Al+Ti)<

0.6.

3. The solder joint claimed in claim 1, wherein the solder joint forms the metal junction between the alloy and the Al surface.

4. The solder joint made of the solder alloy claimed in claim 1, wherein the solder joint forms the metal junction between the alloy and the Ni surface.

5. A jointing method comprising forming the solder joint of claim 1.

6. A jointing method comprising forming the solder joint of claim 2.

7. A jointing method comprising forming the solder joint of claim 3.

8. A jointing method comprising forming the solder joint of claim 4.