Solder alloy

  • US 9,808,890 B2
  • Filed: 04/17/2013
  • Issued: 11/07/2017
  • Est. Priority Date: 04/18/2012
  • Status: Active Grant
First Claim
Patent Images

1. A solder joint made of a solder alloy having an alloy composition comprising Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass %, Ni of 0.005 through 0.3 mass % and balance of Sn,wherein the solder joint forms a metal junction between the alloy and an Al surface or an Ni surface.

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